TE28F320B3BA-100 Intel Corporation, TE28F320B3BA-100 Datasheet

TE28F320B3BA-100

Manufacturer Part Number

TE28F320B3BA-100

Description

Manufacturer

Intel Corporation

Datasheet

1.TE28F320B3TA100.pdf (62 pages)

Specifications of TE28F320B3BA-100

Case

TSOP48

Date_code

2006+

Current page: 1 of 62
Download datasheet (2Mb)

Intel

Memory (B3)

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Product Features

The Intel

The B3 device in x16 will be available in 48-lead TSOP and 48-ball CSP packages. The x8

option of this product family is available only in 40-lead TSOP and 48-ball µBGA* packages.

Additional information on this product family can be obtained by accessing Intel’s website at:

http://www.intel.com/design/flash.

Notice: This specification is subject to change without notice. Verify with your local Intel sales

office that you have the latest datasheet before finalizing a design.

m and 0.18 m technologies, represents a feature-rich solution at overall lower system cost.

•

— 2.7 V–3.6 V Read/Program/Erase

— 12 V V

— Reduces Overall System Power

— 2.7 V–3.6 V: 70 ns Max Access Time

— Eight 8-KB Blocks for Data,Top or

— Up to One Hundred Twenty-Seven 64-

— V

— 9 mA Typical Read Current

— V

— –40 °C to +85 °C

— Status Registers

Flexible SmartVoltage Technology

1.65 V–2.5 V or 2.7 V–3.6 V I/O Option

High Performance

Optimized Block Sizes

Block Locking

Low Power Consumption

Absolute Hardware-Protection

Extended Temperature Operation

Automated Program and Block Erase

Bottom Locations

KB Blocks for Code

-Level Control through WP#

= GND Option

Advanced Boot Block Flash Memory (B3) device, manufactured on Intel’s latest 0.13

Lockout Voltage

Advanced Boot Block Flash

Fast Production Programming

•

— Flash Memory Manager

— System Interrupt Manager

— Supports Parameter Storage, Streaming

— Minimum 100,000 Block Erase Cycles

— Typical I

— 48-Ball CSP Packages

— 40- and 48-Lead TSOP Packages

— 8-, 16-, 32- and 64-Mbit Densities

— 16 and 32-Mbit Densities

— 16-, 32- and 64-Mbit Densities

— 8-, 16-, and 32-Mbit Densities

Intel

Extended Cycling Capability

Automatic Power Savings Feature

Standard Surface Mount Packaging

Density and Footprint Upgradeable for

common package

ETOX™ VIII (0.13 m Flash

Technology

ETOX™ VII (0.18 m Flash Technology

ETOX ™ VI (0.25 m Flash Technology

The x8 option not recommended for new

designs

Data (e.g., Voice)

Guaranteed

Flash Data Integrator Software

CCS

after Bus Inactivity

Order Number: 290580-017

Datasheet

May 2003

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