MT47H32M16BN3ITD Micron Semiconductor Products, MT47H32M16BN3ITD Datasheet

MT47H32M16BN3ITD

Manufacturer Part Number

MT47H32M16BN3ITD

Description

BGA

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT47H32M16BN25ED.pdf (139 pages)

Specifications of MT47H32M16BN3ITD

Date_code

05+

Current page: 1 of 139
Download datasheet (10Mb)

DDR2 SDRAM

MT47H128M4 – 32 Meg x 4 x 4 banks

MT47H64M8 – 16 Meg x 8 x 4 banks

MT47H32M16 – 8 Meg x 16 x 4 banks

Features

• Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 4 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Selectable burst lengths: 4 or 8

• Adjustable data-output drive strength

• 64ms, 8,192-cycle refresh

• On-die termination (ODT)

• Industrial temperature (IT) option

• Automotive temperature (AT) option

• RoHS compliant

• Supports JEDEC clock jitter specification

PDF: 09005aef82f1e6e2

Rev. M 9/08 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Options

• Configuration

• FBGA package (Pb-free) – x16

• FBGA package (Pb-free) – x4, x8

• FBGA package (lead solder) – x16

• FBGA package (lead solder) – x4, x8

• Timing – cycle time

• Self refresh

• Operating temperature

• Revision

– 256 Meg x 4 (32 Meg x 4 x 4 banks)

– 128 Meg x 8 (16 Meg x 8 x 4 banks)

– 64 Meg x 16 (8 Meg x 16 x 4 banks)

– 84-ball FBGA (12mm x 12.5mm) Rev. B

– 84-ball FBGA (10mm x 12.5mm) Rev. D

– 84-ball FBGA (8mm x 12.5mm) Rev. F

– 60-ball FBGA (12mm x 10mm) Rev. B

– 60-ball FBGA (10mm x 10mm) Rev. D

– 60-ball FBGA (8mm x 10mm) Rev. F

– 84-ball FBGA (12mm x 12.5mm) Rev. B

– 84-ball FBGA (10mm x 12.5mm) Rev. D

– 84-ball FBGA (8mm x 12.5mm) Rev. F

– 60-ball FBGA (12mm x 10mm) Rev. B

– 60-ball FBGA (10mm x 10mm) Rev. D

– 60-ball FBGA (8mm x 10mm) Rev. F

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 4 (DDR2-667)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

– 5.0ns @ CL = 3 (DDR2-400)

– Standard

– Low-power

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– Automotive, Revision :D only

Note:

–40°C ≤ T

(–40°C ≤ T

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 DDR2 SDRAM

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

product offerings and availability.

≤ 85°C)

, T

≤ 105°C)

≤ 95°C;

≤ 85°C)

www.micron.com

Features

Marking

:B/:D/:F

128M4

32M16

for

64M8

None

-25E

-37E

-3E

-5E

-25

-3

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