MT48H8M16LFB48ITJ Micron Semiconductor Products, MT48H8M16LFB48ITJ Datasheet

MT48H8M16LFB48ITJ

Manufacturer Part Number

MT48H8M16LFB48ITJ

Description

BGA

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT48H8M16LFB48ITJ.pdf (86 pages)

Specifications of MT48H8M16LFB48ITJ

Date_code

08+

Current page: 1 of 86
Download datasheet (3Mb)

Mobile Low-Power SDR SDRAM

MT48H8M16LF – 2 Meg x 16 x 4 banks

MT48H4M32LF – 1 Meg x 32 x 4 banks

Features

• V

• Fully synchronous; all signals registered on positive

• Internal, pipelined operation; column address can

• 4 internal banks for concurrent operation

• Programmable burst lengths (BL): 1, 2, 4, 8, and con-

• Auto precharge, includes concurrent auto precharge

• Auto refresh and self refresh modes

• LVTTL-compatible inputs and outputs

• On-chip temperature sensor to control self refresh

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Selectable output drive strength (DS)

• 64ms refresh period

PDF: 09005aef832ff1ea

128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN

edge of system clock

be changed every clock cycle

tinuous

rate

DDQ

= 1.7–1.95V

Products and specifications discussed herein are subject to change by Micron without notice.

128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM

Table 1: Configuration Addressing

Table 2: Key Timing Parameters

Architecture

Number of banks

Bank address balls

Row address balls

Column address balls

Notes:

Options

• V

• Addressing

• Configuration

• Plastic “green” packages

• Timing: cycle time

• Operating temperature range

• Revision

Speed

Grade

Note:

– Standard addressing option

– 8 Meg x 16 (2 Meg x 16 x 4 banks)

– 4 Meg x 32 (1 Meg x 32 x 4 banks)

– 54-ball VFBGA (8mm x 8mm)

– 90-ball VFBGA (8mm x 13mm)

– 6ns at CL = 3

– 7.5ns at CL = 3

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

-75

-6

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1. Available only for x16 configuration.

2. Available only for x32 configuration.

1. CL = CAS (READ) latency

DDQ

Clock Rate (MHz)

CL = 2

: 1.8V/1.8V

104

8 Meg x 16

BA0, BA1

CL = 3

A[11:0]

A[8:0]

166

133

CL = 2

8ns

Access Time

4 Meg x 32

BA0, BA1

A[11:0]

Features

Marking

A[7:0]

CL = 3

8M16

4M32

None

5.4ns

-75

5ns

-6

Related parts for MT48H8M16LFB48ITJ

Related keywords

MT48H8M16LFB48ITJ datasheet
MT48H8M16LFB48ITJ data sheet
MT48H8M16LFB48ITJ pdf datasheet
MT48H8M16LFB48ITJ component
MT48H8M16LFB48ITJ part
MT48H8M16LFB48ITJ distributor
MT48H8M16LFB48ITJ RoHS
MT48H8M16LFB48ITJ datasheet download