SFC2280-10.TF Semtech Corporation, SFC2280-10.TF Datasheet

SFC2280-10.TF

Manufacturer Part Number

SFC2280-10.TF

Description

Manufacturer

Semtech Corporation

Datasheet

1.SFC2280-10.TF.pdf (10 pages)

Specifications of SFC2280-10.TF

Case

BGA

Date_code

2009+

Current page: 1 of 10
Download datasheet (660Kb)

The SFC2280-10 is a low pass filter array with integrated

TVS diodes. It is designed to provide bidirectional

filtering of EMI/RFI signals and electrostatic discharge

(ESD) protection in portable electronic equipment. This

state-of-the-art device utilizes solid-state silicon-ava-

lanche technology for superior clamping performance

and DC electrical characteristics. They have been

optimized for use on a speaker port in cellular phones

and other protable electronics.

The device has very low insertion loss in the pass band

(to approximately 10MHz) and high attenuation at

frequencies ranging from 800MHz to 3GHz. Each line

features two stages of TVS diode protection. The TVS

diodes provide effective suppression of ESD voltages

in excess of ±15kV (air discharge) and ±8kV (contact

discharge) per IEC 61000-4-2, level 4. The TVS diodes

are bidirectional for supporting bipolar audio signals

without distortion.

The SFC2280-10 is a 6-bump, 0.5mm pitch flip chip

array with a 3x2 bump grid. It measures 1.5 x 1.0 x

0.65mm. This small outline makes the device espe-

cially well suited for portable applications. The flip chip

design results in lower inductance for optimized filter

and ESD clamping performance.

Revision 11/21/03

PROTECTION PRODUCTS

Description

Circuit Diagram (Each Line)

LOW PASS FILTER

Headset Speaker EMI Filter and ESD Protection

Features

Mechanical Characteristics

Applications

Schematic & PIN Configuration

Flip Chip bidirectional EMI/RFI filter with

integrated ESD protection

ESD protection to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

IEC 61000-4-4 (EFT) 40A (5/50ns)

Filter performance: 20dB attenuation at 800MHz

Small chip scale package requires less board space

Low profile (< 0.65mm)

Bidirectional TVS to support negative voltages in

audio applications

Maximum Dimensions: 1.5 x 1.0 x 0.65 mm

TVS Working voltage: 5V

Series Resistor: 10Ω

Solid-state technology

JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip

Scale Package (CSP)

Marking : Marking Code + Chevron

Packaging : Tape and Reel

Cell Phone Handsets and Accessories

Personal Digital Assistants (PDA’s)

Notebook and Hand Held Computers

Digital Camcorders

Pagers

MP3 Players

3 x 2 Grid CSP TVS (Bottom View)

SFC2280-10

ChipClamp

PRELIMINARY

www.semtech.com

ΤΜ

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