MC14099BDWG ON Semiconductor, MC14099BDWG Datasheet - Page 7

IC LATCH 8BIT ADDRESS 16-SOIC

MC14099BDWG

Manufacturer Part Number
MC14099BDWG
Description
IC LATCH 8BIT ADDRESS 16-SOIC
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet

Specifications of MC14099BDWG

Logic Type
D-Type, Addressable
Circuit
4:4
Output Type
Standard
Voltage - Supply
3 V ~ 18 V
Independent Circuits
1
Delay Time - Propagation
50ns
Current - Output High, Low
8.8mA, 8.8mA
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
16
1
16
1
H
−A−
0.25
G
14X
16X
M
e
D
B
T
F
D
A
9
8
16 PL
S
0.25 (0.010)
B
B
S
9
8
S
A
K
B
C
M
T
−T−
T
SEATING
PLANE
A
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
PLASTIC DIP PACKAGE
http://onsemi.com
CASE 751G−03
J
CASE 648−08
SOIC−16 WB
MC14099B
DW SUFFIX
C
P SUFFIX
PDIP−16
ISSUE C
ISSUE T
7
L
q
M
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INLCUDE
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
PER ASME Y14.5M, 1994.
MOLD PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
DIM
A1
A
B
C
D
E
H
e
h
L
q
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
10.15
10.05
MIN
MILLIMETERS
2.35
0.10
0.35
0.23
7.40
0.25
0.50
0.100 BSC
0.050 BSC
MIN
0
1.27 BSC
INCHES
0
_
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
10.45
10.55
MAX
MAX
0.70
2.65
0.25
0.49
0.32
7.60
0.75
0.90
10
7
_
_
18.80
MILLIMETERS
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
2.54 BSC
1.27 BSC
0
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
_

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