RCLAMP1502B_09 SEMTECH [Semtech Corporation], RCLAMP1502B_09 Datasheet - Page 5

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RCLAMP1502B_09

Manufacturer Part Number
RCLAMP1502B_09
Description
Ultra-Low Capacitance TVS for ESD and CDE Protection
Manufacturer
SEMTECH [Semtech Corporation]
Datasheet
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines, but it is recommended it not be used
much beyond 1GHz due to cross talk limitations. The
device is connected as follows:
One data line can be connected to either pin 1 or pin 2
with the other connected to ground. The connection to
ground should be made directly to a ground plane. The
path length should also be kept as short as possible to
minimize parasitic inductance. Pin 3 is not connected.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
PROTECTION PRODUCTS
© 2009 Semtech Corp.
Applications Information
5
Figure 1. Pin Configuration
RClamp1502B
www.semtech.com

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