HS9-9008RH INTERSIL [Intersil Corporation], HS9-9008RH Datasheet - Page 4

• Manufacturer Part Number: HS9-9008RH
• Description: Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
INTERFACE MATERIALS:
Glassivation:
Top Metallization:
Backside Finish:
Metallization Mask Layout
180 mils x 197 mils x 21 1 mils
Type: SiO
Thickness: 8k
Metal 1 - Type: Moly/TiW
Metal 2- Type: Al/Si/Cu
Silicon
Thickness: 5.8k
Thickness: 10k
2
VDDA2
VSSA2
VREF-
Å
B1
B2
B3
B4
1k
Å
VDDD2
Å
Å
CE1
4
10%
10%
CLK
CE2
VDDD1
VDDA3
HS-9008RH
HS-9008RH
VDDD3
1/2R
VSSD3
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
ADDITIONAL INFORMATION:
Worst Case Current Density:
Process:
V
Metal 1 - Designs using the Intersil AVLSI-1RA process
Metal 2 - 1.63 x 10
AVLSI1RA
DD
VSSD1
VSSA3
take advantage of the superior current carrying
capabilities of Moly.TiW. The current density limit
established by Intersil Reliability is 5.0 x 10
VIN
5
A/cm
VSSD2
2
B5
VSSA1
VREF+
VDDA1
OF
B8
B7
B6
5
A/cm
2