HX6408-EFM HONEYWELL [Honeywell Solid State Electronics Center], HX6408-EFM Datasheet - Page 10

• Manufacturer Part Number: HX6408-EFM
• Description: 512k x 8 STATIC RAM
• Manufacturer: HONEYWELL [Honeywell Solid State Electronics Center]

HX6408
Advanced Information
/TPLDX time, respectively. The minimum write cycle
time is TAVAV.
QUALITY AND RADIATION HARDNESS ASSURANCE
Honeywell maintains a high level of product integrity
through process control, utilizing statistical process
control, a complete
“Total Quality Assurance System,” a computer data
base process performance tracking system and a
radiation-hardness assurance strategy.
The radiation hardness assurance strategy starts with
a technology that is resistant to the effects of
radiation. Radiation hardness is assured on every
wafer by irradiating test structures as well as SRAM
product, and then monitoring key parameters, which
are sensitive to ionizing radiation. Conventional MIL-
STD-883 TM 5005 Group E testing, which includes
total dose exposure with Cobalt 60, may also be
performed as required. This Total Quality approach
ensures our customers of a reliable product. It starts
with process development and continuing through
product qualification and screening.
SCREENING LEVELS
Honeywell offers several levels of device screening to
meet your system needs. “Engineering Devices” are
available with limited performance and screening for
operational evaluation testing. Hi-Rel Level B and S
devices undergo additional screening per the
requirements of MILSTD-883. As a QML supplier,
Honeywell also offers QML Class Q and V devices
per MIL-PRF-38535 and are available per the
applicable Standard Microcircuit Drawing (SMD). QML
devices offer ease of procurement by eliminating the
PACKAGING
The 512K x 8 SRAM is offered in a commercially
compatible 36-lead flat pack. This package is
constructed of multi-layer ceramic (Al
contains internal power and ground planes.
Parentheses denote pin options. These pins are
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2
O
3
) and
available as NC to conform to commercial
standards. All NC (no connect) pins should be
connected to VSS to prevent charge build up in
the radiation environment.
need to create detailed specifications and offer
benefits of improved quality and cost savings through
standardization.
RELIABILITY
Honeywell understands the stringent reliability
requirements for space and defense systems and has
extensive experience in reliability testing on programs
of this nature. This experience is derived from
comprehensive testing of VLSI processes. Reliability
attributes of the RICMOS™ SOI process were
characterized by testing specially designed irradiated
and non-irradiated test structures from which specific
failure mechanisms were evaluated. These specific
mechanisms included, but were not limited to, hot
carriers, electromigration and time dependent
dielectric breakdown. This data was then used to
make changes to the design models and process to
ensure more reliable products.
In addition, the reliability of the RICMOS™ SOI
process and product in a military environment is
monitored by testing
irradiated and non-irradiated circuits in accelerated
dynamic life test conditions. Packages were qualified
for product use after undergoing Groups B & D testing
as outlined in MIL-STD-883, TM 5005, Class S.
Quality conformance testing is performed as an option
on all production lots to ensure the ongoing reliability
of the product.