HX6656 ETC1 [List of Unclassifed Manufacturers], HX6656 Datasheet - Page 4

• Manufacturer Part Number: HX6656
• Description: 32K x 8 ROM-SOI
• Manufacturer: ETC1 [List of Unclassifed Manufacturers]

HX6656
ABSOLUTE MAXIMUM RATINGS (1)
(1) Stresses in excess of those listed above may result in permanent damage. These are stress ratings only, and operation at these levels is not
(2) Voltage referenced to VSS.
(3) ROM power dissipation (IDDSB + IDDOP) plus ROM output driver power dissipation due to external loading must not exceed this specification.
(4) Class 2 electrostatic discharge (ESD) input protection. Tested per MIL-STD-883, Method 3015 by DESC certified lab.
RECOMMENDED OPERATING CONDITIONS
CAPACITANCE (1)
(1) This parameter is tested during initial design characterization only.
Θ
VDD
VPIN
TSTORE
TSOLDER
PD
IOUT
VPROT
TJ
implied. Frequent or extended exposure to absolute maximum conditions may affect device reliability.
Symbol
JC
Symbol
VDD
TA
VPIN
CI
CO
Symbol
Input Capacitance
Output Capacitance
Positive Supply Voltage (2)
Voltage on Any Pin (2)
Storage Temperature (Zero Bias)
Soldering Temperature • Time
Total Package Power Dissipation (3)
DC or Average Output Current
ESD Input Protection Voltage (4)
Junction Temperature
Thermal Resistance (Jct-to-Case)
Supply Voltage (referenced to VSS)
Ambient Temperature
Voltage on Any Pin (referenced to VSS)
Parameter
Parameter
Parameter
Typical
(1)
28 FP/36 FP
28 DIP
4
Worst Case
Min
Max
7
9
-0.3
Min
4.5
-55
2000
-0.5
-0.5
-65
Min
Units
pF
pF
Description
Rating
Typ
5.0
25
VI=VDD or VSS, f=1 MHz
VIO=VDD or VSS, f=1 MHz
VDD+0.5
270•5
Max
150
175
7.0
2.5
VDD+0.3
25
10
2
Test Conditions
125
Max
5.5
°C/W
Units
Units
°C•s
mA
°C
°C
W
V
V
V
°C
V
V