TQM879008 TRIQUINT [TriQuint Semiconductor], TQM879008 Datasheet - Page 10

• Manufacturer Part Number: TQM879008
• Manufacturer: TRIQUINT [TriQuint Semiconductor]

Data Sheet: Rev G 12/10/12
© 2012 TriQuint Semiconductor, Inc.
TQM879008
1.5-2.7GHz ½ W Digital Variable Gain Amplifier
Package Information and Dimensions
PCB Mounting Pattern
Notes:
Markings:
Part Number: TQM879008
Lot Code: ‘YY’ is the year of manufacture
Mechanical Information
1.
2.
3.
4.
1
1.
2.
3.
4.
5.
All dimensions are in millimeters. Angles are in degrees.
Use 1 oz. copper minimum for top and bottom layer metal.
Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a
0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
‘WW’ is the work week
‘AaXXXX’ is the Assembly code
All dimensions are in millimeters. Angles are in degrees.
Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin profile,
fine pitch, internal stacking module (ISM).
Dimension and tolerance formats conform to ASME Y14.4M-1994.
The contact pin numbering convention and pin 1 identifier conform to JESD 95-1 SPP-012.
Coplanarity applies to the exposed ground/thermal pad as well as the contact pins.
30X
3
0.66
0.38
COMPONENT SIDE
PACKAGE
OUTLINE
0.76
28X 0.73
28X
4
TERMINAL #1
IDENTIFIER
.10 C
.08 C
5
2X
2X
28X 0.40
.10 C
.10 C
4.20
- 10 of 11-
YYWW CCCC
TQM879008
TriQuint
AXXXXX
YYWW
0.70 PITCH
6.0±0.1
9005
4.20
0.35
Connecting the Digital World to the Global Network
1.02±0.08
6.0±0.1
Disclaimer: Subject to change without notice
C
SEATING PLANE
28X 0.10
5.35
2.10
2.10
28X 0.70 Pitch
(1X) shape
0.70
2.10
0.10
C A B
2.10
GND/THERMAL PAD
0.70
TERMINAL #1
IDENTIFIER
(28X) 0.450x X 0.400y
0.10
5
C A B
®
4