EMIF03-SIM02C2_10 STMICROELECTRONICS [STMicroelectronics], EMIF03-SIM02C2_10 Datasheet - Page 6

• Manufacturer Part Number: EMIF03-SIM02C2_10
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
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Package information
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In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 14. Flip-Chip dimensions
Figure 15. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
ECOPACK status
Epoxy meets UL94, V0
Lead-free package
(y = year
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
x
y
Doc ID 13251 Rev 3
w
x
1.42mm ± 50µm
w
z
500µm ± 50
315µm ± 50
Figure 16. Footprint recommendation
340 µm min for 315 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
695µm ± 65
EMIF03-SIM02C2
®