GSD2004S-V-GS08/BKN Vishay, GSD2004S-V-GS08/BKN Datasheet - Page 2

• Manufacturer Part Number: GSD2004S-V-GS08/BKN
• Manufacturer: Vishay

GSD2004S-V
Vishay Semiconductors
Thermal Characteristics
T
1)
Electrical Characteristics
T
1)
Layout for R
Thickness:
Fiberglass 1.5 mm (0.059 in.)
Copper leads 0.3 mm (0.012 in.)
www.vishay.com
2
Typical thermal resistance
junction to ambient air
Junction temperature
Storage temperature range
Reverse breakdown voltage
Leakage current
Forward voltage
Diode capacitance
Reverse recovery time
amb
amb
Device on Fiberglass Substrate, see layout on second page
Device on Fiberglass Substrate, see layout
= 25 °C, unless otherwise specified
= 25 °C, unless otherwise specified
Parameter
Parameter
thJA
test
I
V
V
I
I
V
I
R
R
F
F
F
R
R
F
L
= 20 mA
= 100 mA
= I
= 100 μA
= V
= 100 Ω
= 240 V
= 240 V, T
R
R
= 30 mA, I
15 (0.59)
= 0, f = 1 MHz
Test condition
Test condition
j
12 (0.47)
= 150 °C
rr
= 3.0 mA,
0.8 (0.03)
5 (0.2)
1.5 (0.06)
7.5 (0.3)
3 (0.12)
5.1 (0.2)
Symbol
V
C
1 (0.4)
V
V
I
I
t
BR
R
R
tot
rr
F
F
Symbol
R
T
thJA
T
S
j
2 (0.8)
2 (0.8)
Min
300
17451
1 (0.4)
- 65 to + 150
Value
357
0.83
Typ.
150
1)
Document Number 85728
Max
0.87
1.00
100
100
5.0
50
Rev. 1.4, 03-Jan-06
°C/W
Unit
°C
°C
Unit
nA
μA
pF
ns
V
V
V