MC100ELT25DTG ON Semiconductor, MC100ELT25DTG Datasheet - Page 2

• Manufacturer Part Number: MC100ELT25DTG
• Description: IC XLATOR ECL-TTL DIFF 8TSSOP
• Manufacturer: ON Semiconductor
• Series: 100ELTr

Specifications of MC100ELT25DTG

• Logic Function: Translator
• Number Of Bits: 1
• Input Type: ECL
• Output Type: TTL
• Number Of Channels: 1
• Number Of Outputs/channel: 1
• Differential - Input:output: Yes/No
• Propagation Delay (max): 4.1ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Supply Voltage: 4.5 V ~ 5.5 V
• Logic Family: ECL
• Logical Function: Translator
• Technology: ECL
• High Level Output Current: -3mA
• Low Level Output Current: 24mA
• Translation: ECL to TTL
• Operating Supply Voltage (typ): ±5V
• Package Type: TSSOP
• Operating Supply Voltage (max): -5.7/5.5V
• Operating Supply Voltage (min): -4.2/4.5V
• Abs. Propagation Delay Time: 4.1ns
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC100ELT25DTGOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
Symbol
V
V
V
I
T
T
q
q
q
q
q
T
q
BB
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
IN
Figure 1. 8−Lead Pinout (Top View) and Logic
V
V
Positive Power Supply
Negative Power Supply
Input Voltage
V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
EE
BB
BB
D
D
Sink/Source
1
2
3
4
Table 2. ATTRIBUTES
1. For additional information, see Application Note AND8003/D.
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
ECL
Diagram
Parameter
TTL
Characteristics
8
7
6
5
V
Q
NC
GND
Pb−Free
CC
Pb
http://onsemi.com
Oxygen Index: 28 to 34
GND = 0 V
GND = 0 V
GND = 0 V
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
Human Body Model
Condition 1
Machine Model
2
TSSOP−8
Table 1. PIN DESCRIPTION
D, D
Q
V
V
V
GND
NC
EP
SOIC−8
BB
CC
EE
DFN8
Pin
V
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
EE
CC
Condition 2
= −5.0 V
ECL Differential Inputs
TTL Output
Reference Voltage Output
Positive Supply
Negative Supply
Ground
No Connect
(DFN8 only) Thermal exposed pad must be con-
nected to a sufficient thermal conduit. Electric-
ally connect to the most negative supply (GND)
or leave unconnected, floating open.
= +5.0 V
Pb Pkg
Level 1
Level 1
Level 1
UL 94 V−0 @ 0.125 in
38 Devices
> 400 V
> 1 kV
Value
75 kW
N/A
Pb−Free Pkg
Level 1
Level 3
Level 1
Function
41 to 44 ± 5%
−65 to +150
−40 to +85
0 to V
41 to 44
35 to 40
Rating
± 0.5
190
130
185
140
129
265
265
−8
84
7
EE
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
°C
°C
°C
V
V
V