FT231XS-U FTDI, FT231XS-U Datasheet - Page 40

• Manufacturer Part Number: FT231XS-U
• Description: USB Interface IC USB to Full Serial UART IC SSOP-20
• Manufacturer: FTDI

Specifications of FT231XS-U

• Rohs: yes
• Tradename: X-Chip

9.5 Solder Reflow Profile
The FT231X is supplied in Pb free 20 LD SSOP and QFN-20 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.5.
Figure 9.5 FT231X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT231X is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT231X is used with non-Pb free solder).
Table 9.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2013 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
FT231X USB TO FULL HANDSHAKE UART IC
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
p
150°C
200°C
217°C
260°C
t
L
Document No.: FT_000565 Clearance No.:
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Non-Pb Free Solder Process
p
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
Datasheet
Version 1.2
FTDI# 261
40