93LC56C-I/MS Microchip Technology, 93LC56C-I/MS Datasheet - Page 20

• Manufacturer Part Number: 93LC56C-I/MS
• Description: IC EEPROM 2KBIT 3MHZ 8MSOP
• Manufacturer: Microchip Technology

Specifications of 93LC56C-I/MS

• Memory Size: 2K (256 x 8 or 128 x 16)
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Memory Configuration: 256 X 8 / 128 X 16
• Ic Interface Type: Microwire
• Clock Frequency: 3MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: MSOP
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 93LC56C-I/MSG; 93LC56C-I/MSG; 93LC56C-I/MSR; 93LC56C-I/MSR

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21794E-page 20
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
A1
D2
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MIN
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
© 2007 Microchip Technology Inc.
1
N
MAX
1.00
0.05
1.75
1.90
0.30
0.50
–
E2
NOTE 1