VN5R003HTR-E STMicroelectronics, VN5R003HTR-E Datasheet
VN5R003HTR-E
Specifications of VN5R003HTR-E
Available stocks
Related parts for VN5R003HTR-E
VN5R003HTR-E Summary of contents
Page 1
... When IN is left open, device is in OFF-state and behaves like a power diode between Source and Drain pins. Tube VN5R003H-E Doc ID 17602 Rev. 5 VN5R003H-E − Datasheet production data FT00135 HPak ® ® VIPower technology Order codes Tape and reel VN5R003HTR-E 1/20 www.st.com 1 ...
Page 2
Contents Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical ...
Page 3
VN5R003H-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 4
List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 5
VN5R003H-E 1 Block diagram and pin description Figure 1. Block diagram Table 2. Pin function Name Drain Source IN DRIVER DRIVER Power MOS drain Power MOS source Control pin Doc ID 17602 Rev. 5 Block diagram and ...
Page 6
Block diagram and pin description Figure 2. Configuration diagram (top view) 6/20 Doc ID 17602 Rev. 5 VN5R003H SOURCE 2 - SOURCE DRAIN SOURCE 7 - SOURCE TAB ...
Page 7
VN5R003H-E 2 Electrical specifications Figure 3. Current and voltage conventions 2.1 Absolute maximum ratings Stressing the device above the rating listed in device. These are stress ratings only and operation of the device at these or any other conditions above ...
Page 8
Electrical specifications 2.2 Thermal data Table 4. Thermal data Symbol R Thermal resistance junction-case thj-case Thermal resistance junction-ambient (mounted on FR4 R thj-amb using 6 cm 2.3 Electrical characteristics Table 5. Power section for reverse battery mode Symbol Parameter V ...
Page 9
VN5R003H-E Table 6. Electrical transient requirements (part 1) ISO 7637-2: 2004(E) Test pulse ( ( The above test levels must be considered referred The device does not turn Off once ...
Page 10
Electrical specifications Figure 4. Maximum pulsed drain current (V Note: PCB FR4 area = mm, PCB thickness = 2 mm, Cu thickness = 35 mm, Copper areas: minimum pad lay-out and 2 cm 10/ ...
Page 11
VN5R003H-E 3 Application information Figure 5 shows the solution for systems supplied directly from the battery. If the system goes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zero quiescent current. System is still supplied ...
Page 12
Package and PC board thermal data 4 Package and PC board thermal data 4.1 HPAK thermal data Figure 7. PC board Note: Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%, board double layer, board ...
Page 13
VN5R003H-E Figure 9. HPAK thermal impedance junction ambient single pulse Figure 10. Thermal fitting model of a single-channel HSD in HPAK Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections ...
Page 14
Package and PC board thermal data Equation 1: pulse calculation formula where δ Table 9. Thermal parameter Area/island (cm R1 (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 ...
Page 15
VN5R003H-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...
Page 16
Package and packing information Table 10. HPAK mechanical data Ref. dim (L1 16/20 Data book mm Typ Min. — ...
Page 17
VN5R003H-E 5.3 HPAK suggested land pattern Figure 12. HPAK suggested pad layout 5.4 Packing information Figure 13. HPAK tube shipment (no suffix) a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and soldering process rules ...
Page 18
Package and packing information Figure 14. HPAK tape and reel (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width W Tape hole spacing P0 (± 0.1) Component spacing P Hole diameter ...
Page 19
VN5R003H-E 6 Revision history Table 11. Document revision history Date 23-Jun-2010 06-Jul-2010 06-Oct-2010 18-Nov-2010 17-Apr-2012 Revision 1 Initial release. 2 Updated Table 4: Thermal 3 Added Figure 4: Maximum pulsed drain current (V Changed document status from target specification to ...
Page 20
... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...