M24C01-WBN6P STMicroelectronics, M24C01-WBN6P Datasheet - Page 35

• Manufacturer Part Number: M24C01-WBN6P
• Description: IC EEPROM 1KBIT 400KHZ 8DIP
• Manufacturer: STMicroelectronics

Specifications of M24C01-WBN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 128 K x 8
• Interface Type: I2C
• Maximum Clock Frequency: 0.4 MHz
• Access Time: 900 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 128 X 8
• Clock Frequency: 400kHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8557; M24C01-WBN6P

M24C16, M24C08, M24C04, M24C02, M24C01
9
Revision history
Table 30.
05-May-2000
05-May-2003
10-Dec-1999
23-Nov-2000
09-Nov-2001
19-Feb-2001
04-Feb-2003
17-Mar-2004
18-Apr-2000
20-Apr-2001
08-Oct-2001
07-Oct-2003
30-Jul-2002
Date
Document revision history
Version
2.6
3.2
2.4
2.5
3.0
3.1
3.3
3.4
3.5
3.6
3.7
4.0
5.0
TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
Labelling change to Fig-2D, correction of values for ‘E’ and main caption for
Tab-13
Extra labelling to Fig-2D
SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
Wording brought in to line with standard glossary
Revision of DC and AC characteristics for the -S series
Ball numbers added to the SBGA connections and package mechanical
illustrations
Specification of Test Condition for Leakage Currents in the DC
Characteristics table improved
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range
added
Document title spelt out more fully. “W”-marked devices with tw=5ms
added.
-R voltage range upgraded to 400kHz working, and no longer preliminary
data.
5V voltage range at temperature range 3 (-xx3) no longer preliminary data.
-S voltage range removed. -Wxx3 voltage+temp ranged added as
preliminary data.
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Read
Operations. V
-0.45V. t
MLP package added. Absolute Maximum Ratings for V
V
compliant devices. Device grade information clarified. Process
identification letter “G” information added. 2.2-5.5V range is removed, and
4.5-5.5V range is now Not for New Design
CC
(min) changed. Soldering temperature information clarified for RoHS
Doc ID 5067 Rev 16
W
(max) value for -R voltage range corrected.
IL
(min) improved to
Changes
IO
Revision history
(min) and
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