W25Q80BVDAIG Winbond Electronics, W25Q80BVDAIG Datasheet - Page 72

• Manufacturer Part Number: W25Q80BVDAIG
• Description: SPI FLASH 8MBIT 8-DIP
• Manufacturer: Winbond Electronics

Specifications of W25Q80BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 8M (1M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
Min
MILLIMETERS
SOLDER PATTERN
Nom
3.40
4.30
6.00
0.50
0.75
- 72 -
Max
Min
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
W25Q80BV