AT24C02C-XHM-T Atmel, AT24C02C-XHM-T Datasheet - Page 19

• Manufacturer Part Number: AT24C02C-XHM-T
• Description: IC EEPROM 2KBIT 1MHZ 8TSSOP
• Manufacturer: Atmel

Specifications of AT24C02C-XHM-T

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Density: 2Kb
• Interface Type: Serial (2-Wire)
• Organization: 256x8
• Access Time (max): 550ns
• Frequency (max): 1MHz
• Write Protection: Yes
• Data Retention: 100Year
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Package Type: TSSOP
• Operating Temp Range: -40C to 85C
• Supply Current: 3mA
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8700D–SEEPR–8/10
8Y6 - UDFN
Notes: 1. This drawing is for general information only. Refer to
[e-mail]
Package Drawing Contact:
2. Dimension b applies to metallized terminal and is
3. Soldering the large thermal pad is optional, but not
JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
measured between 0.15mm and 0.30mm from the
terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimension should not be
measured in that radius area.
recommended.
accomplished to the device through this pad, so if
soldered it should be tied to ground
D
Pin 1
Index
Area
No
electrical
TITLE
8Y6, 8-lead, 2.0x3.0mm Body, 0.50mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
A3
A2
connection
A
A1
is
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
1.50 REF.
COMMON DIMENSIONS
e (6X)
(Unit of Measure = mm)
1.40
0.00
0.20
0.20
MIN
D2
–
–
–
Atmel AT24C02C
GPC
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
YNZ
NOM
1.50
0.02
0.30
0.25
–
–
–
DRAWING NO.
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
8Y6
(8X)
Pin 1 ID
b
L (8X)
NOTE
2
11/21/08
REV.
E
19