FDW2507N_Q Fairchild Semiconductor, FDW2507N_Q Datasheet - Page 4

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FDW2507N_Q

Manufacturer Part Number
FDW2507N_Q
Description
MOSFET N-Channel 2.5V Common Drain
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FDW2507N_Q

Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
7.5 A
Resistance Drain-source Rds (on)
19 mOhms
Configuration
Dual Common Quad Drain
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Fall Time
13 ns
Forward Transconductance Gfs (max / Min)
31 S
Minimum Operating Temperature
- 55 C
Power Dissipation
1.6 W
Rise Time
13 ns
Typical Turn-off Delay Time
35 ns
© 2006 Fairchild Semiconductor Corporation
FAN5631/FAN5632 Rev. 1.0.2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Notes:
1.
2.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Symbol
ESD
Junction-to-ambient thermal resistance,
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat
sink characteristics. The estimated value for zero air flow at 0.5W is 60°C/W.
Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model).
I
T
V
V
I
LOAD
Θ
OUT
T
T
T
STG
CC
CC
JC
A
L
J
(2)
V
All other pins to GND
Load Current
Thermal Resistance Junction-to-Tab
Lead Temperature, Soldering 10 Seconds
Junction Temperature
Storage Temperature
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Supply Voltage Range
Output Current (V
Operating Ambient Temperature Range
IN
to GND
Parameter
Parameter
IN
> 2.V)
θ
JA
,
is a strong function of PCB material, board thickness, thickness and
(1)
4
Min.
-40
2.2
Min.
-0.3
-0.3
-40
-65
2.5
0.2
Typ.
+25
V
Max.
IN
+260
+150
+150
6.0
0.5
+ 0.3
8
Max.
+85
250
5.5
www.fairchildsemi.com
°C/W
Unit
°C
°C
°C
kV
V
A
Unit
mA
°C
V

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