Z0109NN0,135 NXP Semiconductors, Z0109NN0,135 Datasheet
Z0109NN0,135
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Z0109NN0,135 Summary of contents
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Z0109NN0 4Q Triac Rev. 3 — 10 May 2011 1. Product profile 1.1 General description Planar passivated sensitive gate four quadrant triac in a SOT223 (SC-73) surface-mountable plastic package intended for applications requiring enhanced immunity to noise and direct interfacing ...
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... NXP Semiconductors Table 1. Symbol Static characteristics Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal main terminal gate 4 T2 main terminal 2 3. Ordering information Table 3. Ordering information Type number Package Name Z0109NN0 SOT223 4. Marking Table 4. Marking codes ...
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... NXP Semiconductors 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM I RMS on-state current T(RMS) I non-repetitive peak on-state TSM current for fusing dI /dt rate of rise of on-state current ...
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... NXP Semiconductors 2.0 conduction form P tot angle factor (W) (degrees 2.8 90 2.2 120 1.9 1.2 180 1.57 0.8 0.4 0.0 0 0.2 Fig 3. Total power dissipation as a function of RMS on-state current; maximum values 16 I TSM ( Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum ...
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... NXP Semiconductors TSM ( (1) ( −5 10 Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values Z0109NN0 Product data sheet −4 − All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 May 2011 Z0109NN0 4Q Triac 003aaf490 ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter R thermal resistance from th(j-sp) junction to solder point R thermal resistance from th(j-a) junction to ambient 3.8 min 1.5 min 1.5 min (3×) 1.5 min 4.6 All dimensions are in mm Fig 6. Minimum footprint SOT223 Z0109NN0 Product data sheet Conditions full cycle; see Figure 8 in free air ...
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... NXP Semiconductors Fig 8. Transient thermal impedance from junction to solder point as a junction of pulse width Z0109NN0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 May 2011 Z0109NN0 4Q Triac © NXP B.V. 2011. All rights reserved ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter Static characteristics I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state current D Dynamic characteristics dV /dt rate of rise of off-state voltage D dV /dt rate of change of commutating com voltage ...
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... NXP Semiconductors GT(25°C) 3 (1) (2) ( (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig 9. Normalized gate trigger current as a function of junction temperature H(25° - Fig 11. Normalized holding current as a function of junction temperature Z0109NN0 Product data sheet ...
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... NXP Semiconductors 1 GT(25°C) 1.2 0.8 0 Fig 13. Normalized gate trigger voltage as a function of junction temperature Z0109NN0 Product data sheet 003aaa209 1.6 A 1.2 0.8 0.4 0 100 150 T (°C) j Fig 14. Normalized critical rate of rise of off-state voltage as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package with increased heatsink; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 Fig 15. Package outline SOT223 (SOT223) Z0109NN0 Product data sheet ...
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... NXP Semiconductors 9. Package outline Fig 16. Package outline SOT223 (SOT223) 10. Soldering 1.3 1.2 (4×) (4×) 1 Fig 17. Reflow soldering footprint for SOT223 (SOT223) Z0109NN0 Product data sheet 6.7 6.3 3.1 2.9 4 7.3 3.7 6.7 3 2.3 4.6 Dimensions 3.85 3.6 3.5 0.3 4 6.1 3 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 May 2011 Z0109NN0 1 ...
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... NXP Semiconductors 1.9 1 Fig 18. Wave soldering footprint for SOT223 (SOT223) Z0109NN0 Product data sheet 8.9 6 2.7 2.7 1.9 1.1 (2×) All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 May 2011 Z0109NN0 solder lands solder resist 8.7 occupied area Dimensions in mm preferred transport direction during soldering 1.9 (3× ...
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... NXP Semiconductors 11. Revision history Table 8. Revision history Document ID Release date Z0109NN0 v.3 20110510 • Modifications: Various changes to content. Z0109NN0 v.2 20110318 Z0109NN0 Product data sheet Data sheet status Change notice Product data sheet - Product data sheet - All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .6 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .8 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .12 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .14 12 Legal information ...