Z0103MA0,116 NXP Semiconductors, Z0103MA0,116 Datasheet
Z0103MA0,116
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Z0103MA0,116 Summary of contents
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Z0103MA0 4Q Triac Rev. 2 — 18 March 2011 1. Product profile 1.1 General description Planar passivated very sensitive gate four quadrant triac in a SOT54 (TO-92) plastic package intended for use in applications requiring enhanced noise immunity and direct ...
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... NXP Semiconductors Table 1. Symbol Static characteristics Pinning information Table 2. Pinning information Pin Symbol Description 1 T2 main terminal gate 3 T1 main terminal 1 3. Ordering information Table 3. Ordering information Type number Package Name Z0103MA0 TO-92 Z0103MA0 Product data sheet Quick reference data … ...
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... NXP Semiconductors 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM I RMS on-state current T(RMS) I non-repetitive peak on-state TSM current for fusing dI /dt rate of rise of on-state current ...
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... NXP Semiconductors 1.2 I T(RMS ) (A) 0.8 0 Fig 1. RMS on-state current as a function of lead temperature; maximum values 2.0 conduction form P tot angle factor (W) (degrees 2.8 90 2.2 120 1.9 1.2 180 1.57 0.8 0.4 0.0 0 0.2 Fig 3. Total power dissipation as a function of RMS on-state current; maximum values Z0103MA0 Product data sheet 003aac264 ...
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... NXP Semiconductors 16 I TSM ( Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values TSM ( (1) ( −5 10 Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values Z0103MA0 Product data sheet 10 − ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance th(j-lead) from junction to lead R thermal resistance th(j-a) from junction to ambient th(j-lead) (K/ Fig 6. Transient thermal impedance from junction to lead as a function of pulse width Z0103MA0 Product data sheet Conditions full cycle ...
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... NXP Semiconductors 6. Characteristics Table 6. Characteristics Symbol Parameter Static characteristics I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state current D Dynamic characteristics dV /dt rate of rise of off-state D voltage dV /dt rate of change of com commutating voltage ...
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... NXP Semiconductors GT(25°C) 3 (1) (2) ( (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature H(25° - Fig 9. Normalized holding current as a function of junction temperature Z0103MA0 Product data sheet ...
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... NXP Semiconductors 1 GT(25°C) 1.2 0.8 0 Fig 11. Normalized gate trigger voltage as a function of junction temperature Z0103MA0 Product data sheet 003aaa209 1.6 A 1.2 0.8 0.4 0 100 150 T (°C) j Fig 12. Normalized critical rate of rise of off-state voltage as a function of junction temperature;typical values All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION ...
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... NXP Semiconductors 8. Revision history Table 7. Revision history Document ID Release date Z0103MA0 v.2 20110318 • Modifications: Various changes to content. Z0103MA0 v.1 20110103 Z0103MA0 Product data sheet Data sheet status Change notice Product data sheet - Product data sheet - All information provided in this document is subject to legal disclaimers. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .6 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Legal information .12 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 9 ...