AT24C02N-10SU-2.7 Atmel, AT24C02N-10SU-2.7 Datasheet - Page 14

• Manufacturer Part Number: AT24C02N-10SU-2.7
• Description: IC EEPROM 2KBIT 400KHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT24C02N-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AT24C02 Ordering Information
Notes:
14
8P3
8S1
8A2
8Y1
5TS1
8U3-1
–2.7
–1.8
Ordering Code
AT24C02-10PU-2.7
AT24C02-10PU-1.8
AT24C02N-10SU-2.7
AT24C02N-10SU-1.8
AT24C02-10TU-2.7
AT24C02-10TU-1.8
AT24C02Y1-10YU-1.8
AT24C02-10TSU-1.8
AT24C02U3-10UU-1.8
AT24C02-W2.7-11
1. This device is not recommended for new design. Please refer to AT24C02B datasheet. For 2.7V devices used in the 4.5V to
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
AT24C01A/02/04/08A/16A
5.5V range, please refer to performance values in the AC and DC characteristics table.
Serial EEPROM Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
(3)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(1)
Package Type
Package
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
5TS1
8U3-1
Die Sale
Options
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
0180Z1–SEEPR–5/07