IS42S16100C1-6TL ISSI, Integrated Silicon Solution Inc, IS42S16100C1-6TL Datasheet - Page 6

• Manufacturer Part Number: IS42S16100C1-6TL
• Description: IC SDRAM 16MBIT 166MHZ 50TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: SDRAMr

Specifications of IS42S16100C1-6TL

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 16M (1M x 16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 50-TSOPII
• Organization: 1Mx16
• Density: 16Mb
• Address Bus: 12b
• Access Time (max): 6/5.5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 150mA
• Pin Count: 50
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6
IS42S16100C1
DC ELECTRICAL CHARACTERISTICS
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time in-
2. Icc
Symbol Parameter
i
i
V
V
i
i
I
i
I
i
i
i
il
ol
cc1
cc2p
cc2ps
cc3N
cc3Ns
cc4
cc5
cc6
oh
ol
creases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between V
to suppress power supply voltage noise (voltage drops) due to these transient currents.
1
and Icc
Input Leakage Current
Output Leakage Current
Output High Voltage Level i
Output Low Voltage Level i
Operating Current
Precharge Standby Current CKE ≤ V
(In Power-Down Mode)
Active Standby Current
(In Non Power-Down Mode)
Operating Current
(In Burst Mode)
Auto-Refresh Current
Self-Refresh Current
4
depend on the output load. The maximum values for Icc
(1)
(1,2)
Test Condition
0V ≤ V
the tested pin at 0V
Output is disabled, 0V ≤ V
One Bank Operation, CAS latency = 3 Com.
Burst Length=1
t
I
CKE ≥ V
t
I
t
CKE ≤ 0.2V
out
out
rc
out
ck
out
rc
= t
≥ t
= t
= –2 mA
= +2 mA
= 0mA
= 0mA
rc
ck
rc
iN
il
ih
≤ Vdd, with pins other than
(min.)
(
(
miN
miN
(
(Recommended Operation Conditions unless otherwise noted.)
(
miN
max
)
)
)
)
t
t
t
t
CAS latency = 3 Com.
CAS latency = 2 Com.
CAS latency = 3 Com.
CAS latency = 2 Com.
ck
ck
ck
ck
out
1
= t
= ∞
= t
= ∞
and Icc
Integrated Silicon Solution, Inc. — www.issi.com
ck
ck
≤ Vdd
(
(
miN
miN
4
are obtained with the output open state.
)
)
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Com.
Ind.
Ind.
Ind.
Ind.
Ind.
Ind.
Ind.
Ind.
Speed
dd
—
—
—
—
—
—
—
—
-5
-6
-7
-7
-5
-6
-7
-7
-5
-6
-7
-7
-5
-6
-7
-7
-5
-6
-7
-7
and GND for each memory chip
Min.
2.4
–5
–5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max.
170
160
140
160
170
150
130
150
170
150
130
150
120
100
120
100
0.4
40
30
30
70
90
70
90
—
5
5
3
4
2
3
1
08/24/09
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
Rev. F
V
V