PCF8579T/1,118 NXP Semiconductors, PCF8579T/1,118 Datasheet - Page 37

• Manufacturer Part Number: PCF8579T/1,118
• Description: IC LCD DRIVER COLUMN 56-VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8579T/1,118

• Package / Case: 56-VSOP
• Display Type: LCD
• Configuration: Dot Matrix
• Interface: I²C
• Current - Supply: 9µA
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Clock Frequency: 10 KHz
• Operating Supply Voltage: 2.5 V to 6 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 150 C
• Attached Touch Screen: No
• Maximum Supply Current: 9 uA
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935278869118; PCF8579TD-T; PCF8579TD-T

NXP Semiconductors
PCF8579_5
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 17.
Table 18.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 17
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
18
28.
Rev. 05 — 11 May 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
LCD column driver for dot matrix graphic displays
3
3
)
)
Figure
350 to 2000
260
250
245
28) than a SnPb process, thus
220
220
350
> 2000
260
245
245
PCF8579
© NXP B.V. 2009. All rights reserved.
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