ADN2843CHIPSET-B Analog Devices Inc, ADN2843CHIPSET-B Datasheet - Page 10

• Manufacturer Part Number: ADN2843CHIPSET-B
• Description: IC CHIPSET LDD DUAL LOOP BAREDIE
• Manufacturer: Analog Devices Inc
• Type: Laser Diode Driver (Fiber Optic)r

Specifications of ADN2843CHIPSET-B

• Rohs Status: RoHS non-compliant
• Data Rate: 10.709Gbps
• Number Of Channels: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Modulation: 80mA
• Current - Bias: 80mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: DICE
• Mounting Type: Surface Mount

ADN2843
NOTES
• FOR OPTIMUM PERFORMANCE, RIBBON BONDS ARE RECOMMENDED ON PADS 1, 5, 12, AND 14. WIRES ARE 3 MIL OR 5 MIL RIBBONS <400 m
• LASER’S ANODE IS CONNECTED TO V
• PARALLEL PLATE DECOUPLING CAPACITORS SHOULD BE >100pF AND BE OF MICROWAVE AVX TYPE, PART NO. GB0159391KA6N (390pF).
• THE RECOMMENDED SUBSTRATE CONNECTION IS TO GND. HOWEVER, PERFORMANCE IS NOT AFFECTED BY CONNECTING THE
• AN INDUCTOR SHOULD BE USED IN THE BIAS CURRENT PATH. A MICROWAVE COMPONENTS COIL 30-1847-GCCAS-01 (48 MIL
• THE EXTERNAL POWER SUPPLY IS CONNECTED AT THE PARALLEL PLATE DECOUPLING CAPACITOR.
•
•
•
LONG. ALL OTHER PINS CAN BE ROUND WIRE <1mm.
12 AND PAD 14 RIBBONS.
SUBSTRATE TO V CC .
SHOULD BE USED.
50
GROUND PLANE
TRANSMISSION LINE
MPD
GROUND PLANE
PARALLEL PLATE
DECOUPLING
CAPACITOR
Figure 6. 10 Gbps Optical Diagram Provided Courtesy of NEL.
P
AV
= 0 dBm, ER = 5 dB, PRBS 31 Pattern.
CC
THROUGH GOLD LAYER ON TOP OF CERAMIC STANDOFF. STANDOFF MINIMIZES LENGTH OF PAD
1
5
Figure 5. Recommended Layout
DATAN
AGND
AGND
DATAP
ALS IMOD_CTRL IBIAS_CTRL
6
V
18
CC
ADN2845
V
CC
BACK FACET LIGHT
–10–
V
CC
IMODNTERM
IMODP
AGND
IBIAS
AGND
15
V
9
CC
IBIAS OUTPUT INDUCTOR
14
10
LASER LIGHT
CERAMIC WITH GOLD
SURFACE THAT CONTACTS
THE LASER’S ANODE
LASER
PARALLEL PLATE
DECOUPLING
CAPACITORS
24 MIL)
REV. 0