LM3406HVMHX/NOPB National Semiconductor, LM3406HVMHX/NOPB Datasheet - Page 17

IC LED DRVR HP CONS CURR 14TSSOP

LM3406HVMHX/NOPB

Manufacturer Part Number
LM3406HVMHX/NOPB
Description
IC LED DRVR HP CONS CURR 14TSSOP
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
High Power, Constant Currentr
Datasheet

Specifications of LM3406HVMHX/NOPB

Constant Current
Yes
Topology
PWM, Step-Down (Buck)
Number Of Outputs
1
Internal Driver
Yes
Type - Primary
Automotive
Type - Secondary
White LED
Frequency
1MHz
Voltage - Supply
6 V ~ 75 V
Mounting Type
Surface Mount
Package / Case
14-TSSOP Exposed Pad, 14-eTSSOP 14-HTSSOP
Operating Temperature
-40°C ~ 125°C
Current - Output / Channel
1.5A
Internal Switch(s)
Yes
Efficiency
96%
For Use With
876-1003 - LM3406 LED DRIVER EVAL BOARDLM3406MHEVAL - BOARD EVAL FOR LM3406MH
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Other names
LM3406HVMHX

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM3406HVMHX/NOPB
Manufacturer:
TI/德州仪器
Quantity:
20 000
Part Number:
LM3406HVMHX/NOPB
0
www.national.com
VIN PIN PROTECTION
The VIN pin also has an ESD structure from the pin to GND
with a breakdown voltage of approximately 80V. Any transient
that exceeds this voltage may damage the device. Although
transient absorption is usually present at the front end of a
switching converter circuit, damage to the VIN pin can still
occur.
When V
charge C
circuit board trace inductance as shown in
cited trace inductance then resonates with the input capaci-
tance (similar to an under-damped LC tank circuit) and
causes voltages at the VIN pin to rise well in excess of both
V
IN
and the voltage at the module input connector as clamped
IN
IN
is hot swapped in, the current that rushes in to
up to the V
IN
value also charges (energizes) the
FIGURE 11. VIN Pin with Typical Input Protection
Figure
11. The ex-
16
by the input TVS. If the resonating voltage at the VIN pin ex-
ceeds the 80V breakdown voltage of the ESD structure, the
ESD structure will activate and then “snap-back” to a lower
voltage due to its inherent design. If this lower snap-back
voltage is less than the applied nominal V
nificant current will flow through the ESD structure resulting
in the IC being damaged.
An additional TVS or small zener diode should be placed as
close as possible to the VIN pins of each IC on the board, in
parallel with the input capacitor as shown in
nor amount of series resistance in the input line would also
help, but would lower overall conversion efficiency. For this
reason, NTC resistors are often used as inrush limiters in-
stead.
30020368
IN
voltage, then sig-
Figure
12. A mi-

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