VNN1NV0413TR STMicroelectronics, VNN1NV0413TR Datasheet - Page 17

• Manufacturer Part Number: VNN1NV0413TR
• Description: MOSFET N-CH 40V 1.7A SOT223
• Manufacturer: STMicroelectronics
• Series: OMNIFET II™r
• Type: Low Sider

Specifications of VNN1NV0413TR

• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 250 mOhm
• Current - Peak Output: 3.5A
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Transistor Polarity: N Channel
• Continuous Drain Current Id: 3.5A
• Drain Source Voltage Vds: 45V
• On Resistance Rds(on): 0.25ohm
• Rds(on) Test Voltage Vgs: 5V
• Power Dissipation Pd: 7W
• On Resistance (max): 250 mOhms
• Maximum Power Dissipation: 7 W
• Mounting Style: SMD/SMT
• Supply Current: 0.1 mA
• Switch Type: Low Side
• Power Switch Family: VNN1NV04
• Power Switch On Resistance: 250mOhm
• Output Current: 1.7A
• Mounting: Surface Mount
• Package Type: SOT-223
• Pin Count: 3 +Tab
• Power Dissipation: 7W
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Voltage - Supply: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2517-2

VND1NV04 - VNN1NV04 - VNS1NV04
4
4.1
Package and PCB thermal data
DPAK thermal data
Figure 30. DPAK PC board
1. Layout condition of R
Figure 31. DPAK R
Cu thickness=35 µm , Copper areas: from minimum pad layout to 16 cm
90
80
70
60
50
40
30
0
footprint
th
thj-amb
PCB Cu heat sink area ( cm^ 2) - ( refer t o PCB layout )
and Z
2
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm,
vs. PCB copper area in open box free air condition
Doc ID 7381 Rev 2
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Package and PCB thermal data
2
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