FPF1016 Fairchild Semiconductor, FPF1016 Datasheet - Page 9

• Manufacturer Part Number: FPF1016
• Description: IC LOAD SWITCH 1V ADVANCED 6ULMP
• Manufacturer: Fairchild Semiconductor
• Series: IntelliMax™r
• Type: High Side Switchr

Specifications of FPF1016

• Number Of Outputs: 1
• Rds (on): 45 mOhm
• Internal Switch(s): Yes
• Current Limit: 1.5A
• Voltage - Input: 0.8 ~ 1.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-UMLP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

FPF1015/6/7/8 Rev. D
Improving Thermal Performance
An improper layout could result in higher junction temperature.
This concern applies when the current is at its continuous
maximum value and is then switched into a large capacitive
load that introduces a large transient current. Since the
FPF1015/6/7/8 does not have thermal shutdown capability, a
proper layout is essential to improving power dissipation of the
switch in transient events and prevents the switch from
exceeding the maximum absolute power dissipation of 1.2W.
The following techniques have been identified to improve the
thermal performance of this family of devices. These techniques
are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
3. The V
generated during a high load current condition. The layout
suggested in Figure 20 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The ON pin trace may be laid-out diagonally from
the device to maximize the area available to the ground pad.
Placing the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly during
high load currents.
Figure 20: Proper layout of output, input and ground copper
Figure 19: Two through hole open vias embedded in DAP
IN
, V
OUT
and GND pins will dissipate most of the heat
area
1 4 M i l
1 5 M i l
9
Demo Board Layout
FPF1015/6/7/8 Demo board has the components and circuitry
to demonstrate FPF1015/6/7/8 load switches functions.
Thermal performance of the board is improved using a few
techniques recommended in the layout recommendations
section of datasheet.
Figure 21. FPF1015/6/7/8 Demo board TOP, SST, ASTOP
and DRL layers
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