AD536AKH Analog Devices Inc, AD536AKH Datasheet - Page 15

• Manufacturer Part Number: AD536AKH
• Description: IC TRUE RMS/DC CONV TO-100-10
• Manufacturer: Analog Devices Inc

Specifications of AD536AKH

• Rohs Status: RoHS non-compliant
• Current - Supply: 1.2mA
• Voltage - Supply: 5.0V ~ 36V, ±3.0V ~ 18V
• Mounting Type: Through Hole
• Package / Case: TO-100, Metal Can (10 Leads)
• Accuracy %: 0.2%
• Bandwidth: 45kHz
• Supply Current: 1.2mA
• Power Dissipation Pd: 500mW
• Supply Voltage Range: 5V To 36V
• Digital Ic Case Style: TO-100
• No. Of Pins: 10
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ORDERING GUIDE
Model
AD536AJD
AD536AJDZ
AD536AKD
AD536AKDZ
AD536AJH
AD536AJHZ
AD536AKH
AD536AKHZ
AD536AJQ
AD536AKQ
AD536ASD
AD536ASD/883B
AD536ASE/883B
AD536ASH
AD536ASH/883B
AD536ASCHIPS
5962-89805012A
5962-8980501CA
5962-8980501IA
1
Z = RoHS Compliant Part.
1
1
1
1
Temperature Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
0.185 (4.70)
0.165 (4.19)
0.040 (1.02) MAX
0.050 (1.27) MAX
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
DIMENSIONS PER JEDEC STANDARDS MO-006-AF
0.500 (12.70)
REFERENCE PLANE
Figure 26. 10-Pin Metal Header Package [TO-100]
Package Description
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
10-Pin Metal Header Package [TO-100]
10-Pin Metal Header Package [TO-100]
10-Pin Metal Header Package [TO-100]
10-Pin Metal Header Package [TO-100]
14-Lead Ceramic Dual In-Line Package [CERDIP]
14-Lead Ceramic Dual In-Line Package [CERDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
20-Terminal Ceramic Leadless Chip Carrier [LCC]
10-Pin Metal Header Package [TO-100]
10-Pin Metal Header Package [TO-100]
Die
20-Terminal Ceramic Leadless Chip Carrier [LCC]
14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
10-Pin Metal Header Package [TO-100]
MIN
BASE & SEATING PLANE
Dimensions shown in inches and (millimeters)
Rev. D | Page 15 of 16
0.021 (0.53)
0.016 (0.40)
(H-10)
(2.92)
0.115
BSC
0.230 (5.84)
BSC
4
3
5
0.160 (4.06)
0.110 (2.79)
2
6
1
7
10
36° BSC
8
9
0.034 (0.86)
0.025 (0.64)
0.045 (1.14)
0.025 (0.65)
Package Option
D-14
D-14
D-14
D-14
H-10
H-10
H-10
H-10
Q-14
Q-14
D-14
D-14
E-20
H-10
H-10
E-20
D-14
H-10
AD536A