SA56004AD,112 NXP Semiconductors, SA56004AD,112 Datasheet - Page 31

• Manufacturer Part Number: SA56004AD,112
• Description: IC TEMP SENSOR 8-SOIC
• Manufacturer: NXP Semiconductors

Specifications of SA56004AD,112

• Package / Case: 8-SOIC (3.9mm Width)
• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Multiplexer, Register Bank
• Sensor Type: External & Internal
• Sensing Temperature: -40°C ~ 125°C, External Sensor
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Temperature Threshold: + 165 C
• Full Temp Accuracy: 1 %
• Digital Output - Bus Interface: SMBus
• Digital Output - Number Of Bits: 11 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Description/function: Digital Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 500 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-3615 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3329-5; 935274525112; SA56004AD

NXP Semiconductors
SA56004X_5
Product data sheet
14.3 Wave soldering
14.4 Reflow soldering
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 20.
Package thickness (mm)
< 2.5
•
•
•
•
•
•
•
•
•
•
•
2.5
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
SnPb eutectic process (from J-STD-020C)
and
21
Rev. 05 — 22 May 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Digital temperature sensor with overtemperature alarms
3
)
Figure
24) than a SnPb process, thus
220
220
350
SA56004X
© NXP B.V. 2008. All rights reserved.
31 of 36