LT1019CS8-2.5 Linear Technology, LT1019CS8-2.5 Datasheet - Page 11

• Manufacturer Part Number: LT1019CS8-2.5
• Description: IC PREC REF 2.5V .2% TOL 8-SOIC
• Manufacturer: Linear Technology

Specifications of LT1019CS8-2.5

• Reference Type: Series, Shunt
• Voltage - Output: 2.5V
• Tolerance: ±0.2%
• Temperature Coefficient: 20ppm/°C
• Voltage - Input: 4 ~ 40 V
• Number Of Channels: 1
• Current - Quiescent: 1.2mA
• Current - Output: 10mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Cathode: -

PACKAGE DESCRIPTIO
.245
MIN
RECOMMENDED SOLDER PAD LAYOUT
.050 BSC
SEATING
.030 ±.005
TYP
PLANE
(0.254 – 1.143)
0.010 – 0.045*
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
.045 ±.005
.160 ±.005
(7.620 – 8.255)
(0.229 – 0.381)
0.300 – 0.325
0.009 – 0.015
(
0.325
8.255
(1.016)
0.040
MAX
+0.889
–0.381
+0.035
–0.015
(0.203 – 0.254)
.008 – .010
)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
(8.509 – 9.398)
(7.747 – 8.509)
0.335 – 0.370
0.305 – 0.335
(0.254 – 0.508)
(0.406 – 0.533)
DIA
0.016 – 0.021**
.010 – .020
(1.651)
0.065
TYP
(0.406 – 1.270)
(MILLIMETERS)
U
.016 – .050
8-Lead Plastic Small Outline (Narrow 0.150)
INCHES
× 45°
(1.270)
0.050
MAX
8-Lead TO-5 Metal Can (0.200 PCD)
(2.54)
0.100
BSC
(1.143 – 1.651)
0.045 – 0.065
GAUGE
PLANE
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1320)
(LTC DWG # 05-08-1610)
(LTC DWG # 05-08-1510)
OBSOLETE
0°– 8° TYP
(12.700 – 19.050)
(4.191 – 4.699)
0.165 – 0.185
0.500 – 0.750
S8 Package
H Package
N8 Package
(1.346 – 1.752)
(0.355 – 0.483)
.053 – .069
.014 – .019
TYP
(0.457 ± 0.076)
0.018 ± 0.003
REFERENCE
PLANE
(3.302 ± 0.127)
0.130 ± 0.005
(3.175)
0.125
MIN
(0.508)
0.020
MIN
**
*
45°TYP
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
(0.711 – 0.864)
0.028 – 0.034
(6.477 ± 0.381)
(1.270)
0.255 ± 0.015*
.050
BSC
(0.101 – 0.254)
.004 – .010
(2.794 – 4.064)
0.110 – 0.160
INSULATING
STANDOFF
SO8 0303
(5.791 – 6.197)
.228 – .244
8
1
2
(10.160)
7
0.400*
MAX
8
1
6
3
(4.801 – 5.004)
.189 – .197
PIN 1
7
2
(0.406 – 0.610)
(0.686 – 1.143)
NOTE 3
0.016 – 0.024
0.027 – 0.045
N8 1098
5
4
H8(TO-5) 0.200 PCD 1197
6
3
(5.080)
0.200
TYP
5
4
LT1019
(3.810 – 3.988)
.150 – .157
NOTE 3
11
1019fd