ADR435AR-REEL7 Analog Devices Inc, ADR435AR-REEL7 Datasheet - Page 9

• Manufacturer Part Number: ADR435AR-REEL7
• Description: IC VREF XFET 5V LN 8-SOIC T/R
• Manufacturer: Analog Devices Inc
• Series: XFET®r

Specifications of ADR435AR-REEL7

• Rohs Status: RoHS non-compliant
• Design Resources: Converting a Single-Ended Signal with AD7982 Differential PulSAR ADC (CN0032) Converting a Single-Ended Signal with AD7984 Differential PulSAR ADC (CN0033) Parametric Measurement Unit and Supporting Components for PAD Appls Using AD5522 and AD7685 (CN0104) Automated Calibration Technique That Reduces AD5360 Offset Voltage to Less Than 1 mV (CN0123) Integrated Device Power Supply for PAD with Output Voltage Range 0 V to 25 V (CN0130) 16 Channels of Programmable Output Span Using AD5360 (CN0131) 40 Channels of Programmable Output Span Using AD5371 (CN0149) Precision Single-Supply Differential ADC Driver for Industrial-Level Signals (CN0180)
• Reference Type: Series
• Voltage - Output: 5V
• Tolerance: ±0.12%
• Temperature Coefficient: 10ppm/°C
• Voltage - Input: 7 ~ 18 V
• Number Of Channels: 1
• Current - Quiescent: 800µA
• Current - Output: 30mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Current - Cathode: -

ABSOLUTE MAXIMUM RATINGS
T
Table 8.
Parameter
Supply Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
= 25°C, unless otherwise noted.
Rating
20 V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
ADR430/ADR431/ADR433/ADR434/ADR435/ADR439
Rev. H | Page 9 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 9. Thermal Resistance
Package Type
8-Lead SOIC_N (R)
8-Lead MSOP (RM)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
130
142
JA
θ
43
44
JC
Unit
°C/W
°C/W