LTC3736EGN#PBF Linear Technology, LTC3736EGN#PBF Datasheet - Page 27

• Manufacturer Part Number: LTC3736EGN#PBF
• Description: IC CTLR SW SYNC DUAL 2PH 24SSOP
• Manufacturer: Linear Technology
• Series: PolyPhase®r
• Type: Step-Down (Buck)r

Specifications of LTC3736EGN#PBF

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.6 ~ 9.8 V
• Current - Output: 1A
• Frequency - Switching: 550kHz ~ 750kHz
• Voltage - Input: 2.75 ~ 9.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP
• Primary Input Voltage: 9.8V
• No. Of Outputs: 2
• Output Voltage: 10V
• Output Current: 1A
• No. Of Pins: 24
• Operating Temperature Range: -40°C To +85°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

PACKAGE DESCRIPTIO
4.50 ± 0.05
3.10 ± 0.05
2.45 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(0.178 – 0.249)
.007 – .0098
.0165 ± .0015
.254 MIN
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(0.406 – 1.270)
.016 – .050
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(MILLIMETERS)
INCHES
0.50 BSC
0.25 ±0.05
U
0.70 ±0.05
0° – 8° TYP
PACKAGE
OUTLINE
(0.38 ± 0.10)
24-Lead Plastic SSOP (Narrow .150 Inch)
.015 ± .004
.045 ±.005
.150 – .165
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1641)
(Reference LTC DWG # 05-08-1697)
.0250 TYP
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
ON THE TOP AND BOTTOM OF PACKAGE
× 45°
PIN 1
TOP MARK
(NOTE 5)
GN Package
UF Package
4.00 ± 0.10
(4 SIDES)
(5.817 – 6.198)
(0.203 – 0.305)
.229 – .244
.008 – .012
(1.351 – 1.727)
.053 – .068
24
1
23
2 3
0.75 ± 0.05
22
21
4
(8.560 – 8.738)
20
5 6 7
.337 – .344*
19
2.45 ± 0.10
(0.635)
(4-SIDES)
.0250
18
0.200 REF
0.00 – 0.05
BSC
17
8 9 10 11 12
16
15 1413
(0.102 – 0.249)
R = 0.115
.004 – .0098
BOTTOM VIEW—EXPOSED PAD
GN24 (SSOP) 0502
TYP
(3.810 – 3.988)
.150 – .157**
(0.838)
.033
REF
LTC3736
23
24
(4 SIDES)
0.23 TYP
0.50 BSC
0.25 ± 0.05
27
1
2
(UF24) QFN 0603
0.38 ± 0.10
3736fa