IR3840WMTR1PBF International Rectifier, IR3840WMTR1PBF Datasheet - Page 33

• Manufacturer Part Number: IR3840WMTR1PBF
• Description: IC REG SYNC BUCK 12A 15-QFN
• Manufacturer: International Rectifier
• Series: SupIRBuck™r
• Type: Step-Down (Buck)r

Specifications of IR3840WMTR1PBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.7 ~ 14.4 V
• Current - Output: 12A
• Frequency - Switching: 225kHz ~ 1.65MHz
• Voltage - Input: 1.5 ~ 16 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 15-PowerVQFN
• Power - Output: 2.5W
• Primary Input Voltage: 16V
• No. Of Outputs: 1
• Output Voltage: 14.4V
• Output Current: 12A
• No. Of Pins: 15
• Operating Temperature Range: -40°C To +125°C
• Output Voltage Adjustable Max, Vout: 14.4V
• Rohs Compliant: Yes
• Dc To Dc Converter Type: Step Down
• Pin Count: 15
• Input Voltage: 16V
• Switching Freq: 225 TO 1650KHz
• Package Type: Power QFN EP
• Output Type: Adjustable
• Switching Regulator: Yes
• Mounting: Surface Mount
• Input Voltage (min): 1.5V
• Operating Temperature Classification: Automotive
• Part Status: Preferred
• Package: PQFN / 5 x 6
• Circuit: Single Output
• Iout (a): 12
• Switch Freq (khz): 250 - 1500
• Input Range (v): 1.5 - 16
• Output Range (v): 0.7 - 0.9*Vin
• Ocp Otp Uvlo Pre-bias Soft Start And: PGOOD + EN + SEQ + OVD
• Design Tool: Yes
• Server Storage: Yes
• Routers Switches: Yes
• Base Station Telecom: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3840WMTR1PBFTR

Rev 9.0
Stencil Design
•
•
The Stencil apertures for the lead lands should be approximately 80% of the area of
the lead lads. Reducing the amount of solder deposited will minimize the
occurrences of lead shorts. If too much solder is deposited on the center pad the part
will float and the lead lands will be open.
The maximum length and width of the land pad stencil aperture should be equal to
the solder resist opening minus an annular 0.2mm pull back to decrease the
incidence of shorting the center land to the lead lands when the part is pushed into
the solder paste.
IR3840WMPbF
33