IDT89HPES6T6G2ZCALG8 IDT, Integrated Device Technology Inc, IDT89HPES6T6G2ZCALG8 Datasheet - Page 15

• Manufacturer Part Number: IDT89HPES6T6G2ZCALG8
• Description: IC PCI SW 6LANE 6PORT 324-FCBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES6T6G2ZCALG8

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 89HPES6T6G2ZCALG8

Thermal Considerations
that is relevant to the thermal performance of the PES6T6G2 switch.
IDT 89HPES6T6G2 Data Sheet
This section describes thermal considerations for the PES6T6G2 (19mm
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 16), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JC
JB
θ
JA
= (T
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Power Dissipation of the Device
Table 16 Thermal Specifications for PES6T6G2, 19x19 mm FCBGA324 Package
)/P
Junction Temperature
Ambient Temperature
, T
Parameter
A(max)
, and P are known, the value of desired
15 of 29
θ
2
CS
FCBGA324 package). The data in Table 16 below contains information
Value
16.8
10.1
3.12
125
), that of the heat sink (
9.2
4.1
0.3
70
θ
JA
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
o
o
C
C
θ
JA
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
Maximum
September 13, 2010
J(max)
θ
JC
(value
value