TLP168J(TPR,U,C,F) Toshiba, TLP168J(TPR,U,C,F) Datasheet - Page 65

• Manufacturer Part Number: TLP168J(TPR,U,C,F)
• Description: PHOTOCOUPLER TRIAC OUT 4-MSOP
• Manufacturer: Toshiba

Specifications of TLP168J(TPR,U,C,F)

• Voltage - Isolation: 2500Vrms
• Number Of Channels: 1
• Voltage - Off State: 600V
• Output Type: AC, Triac, Zero Cross
• Current - Gate Trigger (igt) (max): 3mA
• Current - Hold (ih): 600µA
• Current - Dc Forward (if): 6mA
• Current - Output / Channel: 70mA
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Output Device: PhotoTriac
• Isolation Voltage: 2500 V
• Peak Output Voltage (vdrm): 600 V
• Maximum Input Voltage: 240 VAC
• Maximum Output Voltage: 600 V
• Configuration: 1 Channel
• Maximum Continuous Output Current: 70 mA
• Maximum Input Current: 7.5 mA
• Maximum Operating Temperature: + 100 C
• Maximum Reverse Diode Voltage: 5 V
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Zero-crossing Circuit: Yes
• Number Of Elements: 1
• Forward Voltage: 1.7V
• Repetitive Peak Off-state Volt: 600V
• Operating Temp Range: -10C to 85C
• Output Current: 70mA
• Package Type: MFSOP
• Reverse Breakdown Voltage: 5V
• Mounting: Surface Mount
• Pin Count: 4
• Trigger Current: 3mA
• Zero Crossing Circuit: Yes
• Operating Temperature Classification: Commercial
• Forward Current: 20mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP168J(TPR,U,C,F)); TLP168JFTR

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Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore-
lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden).
Safety Standard Approvals for Photocouplers
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
Construction
Mechanical
60747-5-2
VDE/TÜV
Certified
Devices
Ratings
(min)
Mechanical Construction
DIN
EN
Construction
Package
Internal
Isolation Clearance
Isolation Thickness
Isolation Creepage
Working Insulation
Internal Creepage
Transistor Output
Highest Allowable
Safety Standard Approvals
Voltage (Viorm)
Triac/Thyrsitor
Overvoltage
Photorelay
Path (mm)
IC Output
Path (mm)
(Viotm)
Output
(mm)
(mm)
Max.
TLP280
TLP280-4
TLP281
TLP281-4
4000 Vpk
565 Vpk
4.0
4.0
0.4
–
SOP4/SOP16
LED Chip
Reflective Photocouplers in
Single-Molded Packages
Coupling Medium
TLP284
TLP284-4
TLP285
TLP285-4
(Window)
6000 Vpk
707 Vpk
5.0
5.0
0.4
–
Photo Detector Chip
TLP180
TLP181
TLP260J
TLP261J
Package
(Body)
6000 Vpk
MFSOP6
565 Vpk
4.0
4.0
0.4
Lead
–
65
TLP127
TLP160G
TLP160J
TLP161G
TLP161J
(DIN EN60747-5-2)
MFSOP6
4000 Vpk
565 Vpk
4.0
4.0
–
–
Photo Detector Chip
Transmissive Photocouplers in Single-Molded Packages
TLP2105
TLP2108
TLP2166A
TLP2116
TLP2117
4000 Vpk
565 Vpk
(2 ch)
SO8
4.2
4.2
–
–
TLP176A
TLP176D
TLP176G
TLP197G
TLP206G
LED Chip
2500 Vpk
2.54SOP
565 Vpk
4/6/8
4.0
4.0
–
–
Coupling Medium
(Window)
TLP350
TLP351
TLP560G
TLP560J
TLP561G
TLP561J
TLP227G
TLP227G-2
TLP597G
4000 Vpk
/890 Vpk
630 Vpk
6.4/7.0
6.4/7.0
(0.4)
DIP
–
Package
(Body)
Lead
TLP350F
TLP351F
1140 Vpk
6000 Vpk
(F type)
(0.4)
DIP
8.0
8.0
–