VO3052 Vishay, VO3052 Datasheet - Page 2

• Manufacturer Part Number: VO3052
• Description: ISOL 5.3KVRMS 1CH TRIAC OUT 6DIP
• Manufacturer: Vishay

Specifications of VO3052

• Isolation Voltage: 5300 Vrms
• Package / Case: 6-DIP (0.300", 7.62mm)
• Voltage - Isolation: 5300Vrms
• Number Of Channels: 1
• Voltage - Off State: 600V
• Output Type: AC, Triac, Standard
• Current - Gate Trigger (igt) (max): 10mA
• Current - Hold (ih): 200µA
• Current - Dc Forward (if): 60mA
• Current - Output / Channel: 100mA
• Mounting Type: Through Hole
• Configuration: 1
• Maximum Continuous Output Current: 100 mA
• Maximum Input Current: 60 mA
• Maximum Operating Temperature: + 100 C
• Maximum Power Dissipation: 300 mW
• Maximum Reverse Diode Voltage: 6 V
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Typical Input Voltage: 1.2 V
• Zero-crossing Circuit: No
• Output Device: Triac
• Peak Output Voltage (vdrm): 600 V
• Maximum Input Voltage: 1.5 V
• Maximum Output Voltage: 420 VAC
• Minimum Trigger Current: 10 mA (Max)
• No. Of Channels: 1
• Optocoupler Output Type: Phototriac
• Input Current: 30mA
• Output Voltage: 600V
• Opto Case Style: DIP
• No. Of Pins: 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

VO3052, VO3053
Vishay Semiconductors
Notes
(1)
(2)
Note
(1)
www.vishay.com
2
ABSOLUTE MAXIMUM RATINGS
PARAMETER
INPUT
Reverse voltage
Forward current - continuous
Power dissipation
OUTPUT
Off state output terminal voltage
Peak repetitive surge current
Power dissipation
On-state RMS current
COUPLER
Isolation test voltage
Total power dissipation
Operating temperature
Storage temperature
Soldering temperature
THERMAL CHARACTERISTICS
PARAMETER
Maximum LED junction temperature
Maximum output die junction temperature
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction detector to board
Thermal resistance, junction detector to case
Thermal resistance, junction emitter to
junction detector
Thermal resistance, case to ambient
T
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal
Characteristics of Optocouplers application note.
amb
= 25 °C, unless otherwise specified.
(2)
For technical questions, contact:
Phototriac, 1.5 kV/μs dV/dt, 600 V
PW = 100 ms, 120 pps
Optocoupler, Non Zero Crossing
(1)
TEST CONDITION
(1)
SYMBOL
T
T






jmax.
jmax.
t = 1 s
JEC
JDB
JDC
JED
JEB
CA
10 s
VALUE
3563
125
125
150
139
103
496
78
[e-mail]
VO3052, VO3053
PART
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
SYMBOL
I
V
T(RMS)
P
P
T
I
V
P
T
T
TSM
V
DRM
amb
I
diss
diss
ISO
stg
sld
F
tot
R
T
19996
JD
θ
DB
θ
DC
- 40 to + 100
- 55 to + 150
T
T
T
VALUE
B
C
A
θ
5300
DE
Document Number: 83749
100
600
200
100
300
260
60
6
1
T
θ
θ
A
CA
BA
Package
θ
Rev. 1.8, 20-Oct-10
EC
θ
EB
T
JE
UNIT
V
mW
mW
mW
mA
mA
RMS
°C
°C
°C
V
V
A