JW075H1 Lineage Power, JW075H1 Datasheet - Page 17

• Manufacturer Part Number: JW075H1
• Description: CONVERTER DC/DC 24V 75W OUT
• Manufacturer: Lineage Power
• Series: JW075r
• Type: Isolated with Remote On/Offr

Specifications of JW075H1

• Output: 24V
• Number Of Outputs: 1
• Power (watts): 75W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 24 VDC @ 3.1A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 75W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 88.5%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

April 2008
Thermal Considerations
Heat Transfer with Heat Sinks
Then solve the following equation:
Use Figure 36 to determine air velocity for the 1/2 inch
heat sink. The minimum airflow necessary for the
JW100H module is 0.6 m/s (125 ft./min.).
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) shown below (Figure 37).
Figure 37. Resistance from Case-to-Sink and
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Lineage Power
θ
θ
θ
θ
sa
ca
ca
ca
P
=
=
=
=
D
Sink-to-Ambient
3.75 °C/W
∅
(
------------------------ -
T
(
----------------------- -
(
----------------------- -
T
85 40
C
P
C
T
–
P
12
D
–
C
–
T
D
A
T
)
A
)
)
–
θ
θ
cs
cs
dc-dc Converters; 36 to 75 Vdc Input, 24 Vdc Output; 50 W to 175 W
T
S
(continued)
θ
sa
T
A
8-1304 (C)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
17