ATH006A0X-SRZ Lineage Power, ATH006A0X-SRZ Datasheet - Page 20

• Manufacturer Part Number: ATH006A0X-SRZ
• Description: CONVER DC/DC 0.75 3.63V @ 6A SMD
• Manufacturer: Lineage Power
• Series: Austin MicroLynx™ IIr
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of ATH006A0X-SRZ

• Output: 0.75 ~ 3.63V
• Number Of Outputs: 1
• Power (watts): 21W
• Mounting Type: Surface Mount
• Voltage - Input: 2.4 ~ 5.5V
• Package / Case: 6-SMD Module
• 1st Output: 0.75 ~ 3.63 VDC @ 6A
• Size / Dimension: 1.10" L x 0.45" W x 0.29" H (27.9mm x 11.4mm x 7.2mm)
• Power (watts) - Rated: 21W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 96%
• Approvals: CSA, EN, UL, VDE
• Output Current: 6A
• Input Voltage: 2.4 to 5.5V
• Output Voltage: 0.75 to 3.63V
• Screening Level: Industrial
• Product Length (mm): 27.9mm
• Product Depth (mm): 11.4mm
• Mounting Style: Surface Mount
• Pin Count: 6
• Output Power: 22 W
• Input Voltage Range: 2.2 V to 5.5 V
• Output Voltage (channel 1): 0.75 V to 3.63 V
• Output Current (channel 1): 6 A
• Package / Case Size: SMD
• Output Type: Non-Isolated
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 555-1073-2; CC109104535

Data Sheet
October 2, 2009
Surface Mount Information
Lead Free Soldering
The –Z version Austin MicroLynx II SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 37.
MSL Rating
The Austin MicroLynx II modules have a MSL rating of
1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
LINEAGE
POWER
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
(continued)
Austin MicroLynx
Modules: Soldering and Cleaning Application Note
(AN04-001).
Figure 37. Recommended linear reflow profile
using Sn/Ag/Cu solder.
TM
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
II SMT Non-isolated Power Modules:
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
20