MCP2140DM-TMPSNS Microchip Technology, MCP2140DM-TMPSNS Datasheet - Page 25

• Manufacturer Part Number: MCP2140DM-TMPSNS
• Description: BOARD DEMO FOR MCP2140
• Manufacturer: Microchip Technology

Specifications of MCP2140DM-TMPSNS

• Main Purpose: Interface, IrDA
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: MCP2140
• Primary Attributes: IrDA Controller with PIC18F MCU and Temp Sensor Temp
• Secondary Attributes: Set up as a Data Logger
• Processor To Be Evaluated: MCP2140
• Interface Type: ICSP
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP2140
• Kit Application Type: Sensing - Temperature
• Application Sub Type: Temperature Sensor
• Kit Contents: Board
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: MCP2140DM-TMPSNSR; MCP2140DM-TMPSNSR

4.0
Absolute Maximum Ratings†
Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
Storage Temperature ............................................................................................................................. –65°C to +150°C
Voltage on V
Voltage on RESET with respect to V
Voltage on all other pins with respect to V
Total Power Dissipation
Max. Current out of V
Max. Current into V
Input Clamp Current, I
Output Clamp Current, I
Max. Output Current sunk by any Output pin.......................................................................................................... 25 mA
Max. Output Current sourced by any Output pin..................................................................................................... 25 mA
†
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
2003 Microchip Technology Inc.
Note 1: Power Dissipation is calculated as follows: P
ELECTRICAL CHARACTERISTICS
DD
with respect to V
DD
SS
IK
pin ..................................................................................................................................... 250 mA
OK
(1)
pin .................................................................................................................................. 300 mA
(VI < 0 or VI > V
........................................................................................................................................... 1W
(V0 < 0 or V0 > V
SS
........................................................................................................... -0.3V to +7.5V
SS
...................................................................................................... -0.3V to +14V
DD
SS
)
................................................................................. –0.3V to (V
DD
)
Preliminary
DIS
= V
DD
x {I
DD
-
I
OH
} +
{(V
DD
-V
OH
MCP2140
) x I
OH
DS21790A-page 25
} + (V
DD
OL
+ 0.3V)
20 mA
20 mA
x I
OL
)