AT88SC-SDK1 Atmel, AT88SC-SDK1 Datasheet - Page 63

• Manufacturer Part Number: AT88SC-SDK1
• Description: KIT TUEMA DK CRYPTOMEM SMARTCARD
• Manufacturer: Atmel
• Series: CryptoMemory®r

Specifications of AT88SC-SDK1

• Main Purpose: Memory, EEPROM
• Utilized Ic / Part: AT88SCxx
• Primary Attributes: Tuema Secure Serial EEPROM
• Secondary Attributes: 1k ~ 256k
• Processor To Be Evaluated: AT88SCxx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Embedded: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

56
N
Serial EEPROMs Standard Products (Continued)
SPI Interface (Continued)
3-wire Interface
* Available on Request
Part Number
AT25040A
AT25040B
AT25080A
AT25080B
AT25160A
AT25160B
AT25320A
AT25320B
AT25640A
AT25640B
AT25128A
AT25128B
AT25256A
AT25256B
AT25512
AT93C46D
AT93C46E
AT93C56A
AT93C66A
AT93C86A
ONVOLATILE
Density
(Kbits) Organization VCC (V)
128
128
256
256
512
16
16
32
32
64
64
16
4
4
8
8
1
1
2
4
ATMEL PRODUCT GUIDE
M
1024 x 16/
16384 x 8
16384 x 8
32768 x 8
32768 x 8
65536 x 8
128 x 16/
256 x 16/
EMORY
1024 x 8
1024 x 8
2048 x 8
2048 x 8
4096 x 8
4096 x 8
8192 x 8
8192 x 8
2048 x 8
64 x 16/
512 x 8
512 x 8
128 x 8
64 x 16
256 x 8
512 x 8
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
(C
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
ONTINUED
Speed
(MHz)
Max
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2
2
2
2
2
)
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN, Die/Wafer
DFN (MAP), XDFN, Die/Wafer
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
SOIC, TSOP, dBGA2, DFN,
PDIP, SOIC, TSSOP, DFN
PDIP, SOIC, TSSOP, DFN
PDIP, SOIC, TSSOP, DFN
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (SAP), Die/Wafer
DFN (SAP), Die/Wafer
PDIP, SOIC, TSSOP
(MAP), Die/Wafer
(SAP), Die/Wafer
(SAP), Die/Wafer
Package
Die/Wafer
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
with Sequential Read
with Sequential Read
with Sequential Read
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
x16 Organization
All Serial EEPROMs Parts are RoHS Compliant.
Comments
Winter 2008
(Replaces AT25HP256)
(Replaces AT25HP512)
(Replaces AT25040A)
(Replaces AT25080A)
(Replaces AT25160A)
(Replaces AT25320A)
(Replaces AT25640A)
(Replaces AT25128A)
(Replaces AT25256A)
Replaces AT93C46A
Replaces AT93C46
Availability
2Q2009
4Q2008
4Q2008
1Q2009
1Q2009
2Q2009
2Q2009
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now