EVAL6206PD STMicroelectronics, EVAL6206PD Datasheet - Page 18

EVAL BOARD FOR L6206 SERIES

EVAL6206PD

Manufacturer Part Number
EVAL6206PD
Description
EVAL BOARD FOR L6206 SERIES
Manufacturer
STMicroelectronics
Datasheet

Specifications of EVAL6206PD

Mfg Application Notes
PractiSPIN AppNote
Design Resources
EVAL6206PD/6206PD Gerber Files EVAL6206PD Schematic/Bill of Materials
Main Purpose
Power Management, H Bridge Driver (Internal FET)
Embedded
No
Utilized Ic / Part
L6206
Primary Attributes
2 H-Bridge, 8 ~ 52V Output, Use with PractiSPIN
Secondary Attributes
Temperature Protection, Adjustable Current Limit
Applications
Motor Control
Processor To Be Evaluated
L6206PD
For Use With
497-4138 - EVALUATION BOARD PRACTISPIN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-4135
L6206
Figure 18. Mounting the PowerSO package.
Figure 19. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
Figure 20. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 21. SO24 Junction-Ambient thermal resistance versus on-board copper area.
18/23
º C / W
ºC / W
ºC / W
49
48
47
46
45
44
43
42
41
40
39
43
38
33
28
23
18
13
68
66
64
62
60
58
56
54
52
50
48
1
1
1
2
2
2
3
3
3
4
dissipating area
4
4
Slug soldered
to PCB with
5
5
5
6
s q . c m
s q . cm
s q. cm
6
6
7
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
C o pp er A re a is o n T op S id e
7
7
8
C o p pe r Are a is o n Bo tto m
S id e
C o p pe r Are a is o n To p S i de
8
8
9
9
9
10
10
10
1 1
plus ground layer
dissipating area
Slug soldered
to PCB with
11
11
1 2
12
12
13
dissipating area plus ground layer
contacted through via holes
Slug soldered to PCB with
On-Board Copper Area
On-Board Copper Area
On-Board Copper Area

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