AD9238BCP-40EBZ Analog Devices Inc, AD9238BCP-40EBZ Datasheet - Page 44

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AD9238BCP-40EBZ

Manufacturer Part Number
AD9238BCP-40EBZ
Description
BOARD EVAL WITH AD9238BCP-40
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9238BCP-40EBZ

Number Of Adc's
2
Number Of Bits
12
Sampling Rate (per Second)
40M
Data Interface
Parallel
Inputs Per Adc
1 Differential
Input Range
2 Vpp
Power (typ) @ Conditions
360mW @ 40MSPS
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9238-40
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD9238
Figure 58. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when locally
attached to a ground plane at the PCB. A thermal (filled) via array
to a ground plane beneath the part provides a path for heat to
escape the package, lowering junction temperature. Improved
electrical performance also results from the reduction in package
parasitics due to proximity of the ground plane. Recommended
array is 0.3 mm vias on 1.2 mm pitch. θ
= 26.4°C/W with this
JA
recommended configuration. Soldering the slug to the PCB is a
requirement for this package.
Figure 59. Thermal Via Array
Rev. C | Page 44 of 48

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