AD8332-EVALZ Analog Devices Inc, AD8332-EVALZ Datasheet - Page 55

BOARD EVAL FOR AD8332

AD8332-EVALZ

Manufacturer Part Number
AD8332-EVALZ
Description
BOARD EVAL FOR AD8332
Manufacturer
Analog Devices Inc
Series
X-AMP®r
Datasheets

Specifications of AD8332-EVALZ

Channels Per Ic
1 - Single
Amplifier Type
Variable Gain
Output Type
Differential
Slew Rate
1100 V/µs
-3db Bandwidth
100MHz
Current - Output / Channel
45mA
Operating Temperature
-40°C ~ 85°C
Current - Supply (main Ic)
27.5mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 5.5 V
Board Type
Fully Populated
Utilized Ic / Part
AD8332
Silicon Manufacturer
Analog Devices
Application Sub Type
Variable Gain Amplifier
Kit Application Type
Amplifier
Silicon Core Number
AD8332
Kit Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ORDERING GUIDE
Model
AD8331ARQ
AD8331ARQ-REEL
AD8331ARQ-REEL7
AD8331ARQZ
AD8331ARQZ-RL
AD8331ARQZ-R7
AD8331-EVALZ
AD8332ACP-R2
AD8332ACP-REEL
AD8332ACP-REEL7
AD8332ACPZ-R2
AD8332ACPZ-R7
AD8332ACPZ-RL
AD8332ARU
AD8332ARU-REEL
AD8332ARU-REEL7
AD8332ARUZ
AD8332ARUZ-R7
AD8332ARUZ-RL
AD8332-EVALZ
AD8334ACPZ
AD8334ACPZ-REEL
AD8334ACPZ-REEL7
AD8334-EVALZ
1
Z = RoHS Compliant Part.
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Package Description
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
20-Lead Shrink Small Outline Package (QSOP)
Evaluation Board with AD8331ARQ
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board with AD8332ARU
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board with AD8334ACP
Rev. G | Page 55 of 56
AD8331/AD8332/AD8334
Package Option
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
RQ-20
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
CP-64-1
CP-64-1
CP-64-1

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