551600074-001 National Semiconductor, 551600074-001 Datasheet - Page 8

• Manufacturer Part Number: 551600074-001
• Description: BOARD FOR SOIC LMH6612/19
• Manufacturer: National Semiconductor
• Series: WEBENCH® Buildit Boardr

Specifications of 551600074-001

• Channels Per Ic: 2 - Dual
• Amplifier Type: General Purpose
• Board Type: Bare (Unpopulated)
• Utilized Ic / Part: LMH6612, LMH6619
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Output Type: -
• Current - Output / Channel: -
• Voltage - Supply, Single/dual (±): -
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply (main Ic): -

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Power Supply Performance
PSRR
I
I
S
SD
Symbol
6-Pin TSOT23
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: The maximum power dissipation is a function of T
P
Note 4: Boldface limits apply to temperature range of −40°C to 125°C
Note 5: Voltage average drift is determined by dividing the change in V
Note 6: Do not short circuit the output. Continuous source or sink currents larger than the I
Note 7: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 8: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using the Statistical Quality
Control (SQC) method.
Note 9: This parameter is guaranteed by design and/or characterization and is not tested in production.
Connection Diagrams
Ordering Information
8-Pin SOIC
D
Package
= (T
J(MAX)
Power Supply Rejection Ratio
Supply Current (LMH6611)
Supply Current (LMH6612)
(per channel)
Disable Shutdown Current
(LMH6611)
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Parameter
LMH6611MKE
LMH6611MKX
LMH6612MAX
Part Number
LMH6611MK
LMH6612MA
6-Pin TSOT23
Top View
DC, V
R
R
DISABLE = −5V
L
L
Package Marking
=
=
30033601
J(MAX)
LMH6612MA
∞
∞
CM
, θ
AX4A
= −4.5V, V
JA
. The maximum allowable power dissipation at any ambient temperature is
OS
Condition
by temperature change.
S
8
= 2.7V to 11V
OUT
2.5k Units Tape and Reel
250 Units Tape and Reel
1k Units Tape and Reel
3k Units Tape and Reel
typical are not recommended as they may damage the part.
Transport Media
95 Rail/Units
(Note
8-Pin SOIC
Min
Top View
81
8)
(Note
3.45
Typ
160
3.3
96
7)
30033678
(Note
NSC Drawing
Max
4.05
4.85
212
3.8
4.4
MK06A
M08A
8)
Units
mA
dB
μA