STEVAL-IFS002V2 STMicroelectronics, STEVAL-IFS002V2 Datasheet - Page 46

BOARD EVAL BASED ON LIS3LV02DL

STEVAL-IFS002V2

Manufacturer Part Number
STEVAL-IFS002V2
Description
BOARD EVAL BASED ON LIS3LV02DL
Manufacturer
STMicroelectronics
Series
MEMSr
Datasheets

Specifications of STEVAL-IFS002V2

Sensor Type
Accelerometer, 3 Axis
Sensing Range
±2g, 8g
Interface
Analog and Digital
Embedded
No
Utilized Ic / Part
LIS302ALB, LIS302DL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Sensitivity
-
Other names
497-8261
Package information
9
46/48
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
ECOPACK
Figure 28. LGA-16 mechanical data and package dimensions
®
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
Metal Pad
Detail A
N
R
e
d
h
k
s
i
specifications are available at: www.st.com.
D1
0.180
4.250
7.350
0.965
1.200
MIN.
0.64
0.75
0.45
(4 x)
i
B
k
i
A
C
C
A
A
B
0.220
4.400
7.500
5.000
0.975
0.150
0.050
0.100
0.100
TYP.
0.92
0.65
mm
B
1.0
0.3
2.5
1.2
0.8
0.5
E
P2
MAX.
0.260 0.0071 0.0087 0.0102
4.550 0.1673 0.1732 0.1791
7.650 0.2894 0.2953 0.3012
0.985 0.0380 0.0384 0.0388
1.600 0.0472
0.66
0.85
0.55
0.7
1
E1
Solder mask
opening
0.0252 0.0256 0.0260
0.0295 0.0315 0.0335
0.0177 0.0197 0.0217
MIN.
h
C
k
A
0.0394
0.0118
0.1969
0.0984
0.0472
0.0059
0.0020
0.0039
0.0039
D
TYP.
B
inch
D
k
0.0394
0.0276
0.0630
P1
E
seating plane
MAX.
h
C
A
B
A3
R
A2
A1
i
i
C
Land Grid Array Package
LGA16 (4.4x7.5x1mm)
MECHANICAL DATA
Detail A
N1
e
OUTLINE AND
d
®
16
15
is an ST trademark.
14
1
E
13
2
N
12
3
L1
11
4
e
10
5
6
9
7863679 B
T2
7
8
s
D
LIS3LV02DL
T1
®

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