DEMO9S08LG32 Freescale Semiconductor, DEMO9S08LG32 Datasheet - Page 39

• Manufacturer Part Number: DEMO9S08LG32
• Description: DEMO BOARD FOR LG32 FAMILY MCU
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08LG32

• Contents: Board, CD
• Processor To Be Evaluated: MC9S08LG32x
• Data Bus Width: 8 bit
• Interface Type: USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08LG
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08LG32
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

3.1
Example of the device numbering system:
4
4.1
The following pages are mechanical drawings for the packages described in
available drawings please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
Freescale Semiconductor
(S = Maskset specific partnumber)
Pin Count
80
64
48
Status/Partnumber Type
Device Numbering System
Package Information
Mechanical Drawings
(9 = FLASH-based)
(MC = Fully Qualified)
(9 = FLASH-based)
Low Quad Flat Package
Low Quad Flat Package
Low Quad Flat Package
Memory
Family
Core
Package Type
Memory
Status
Family
Core
Figure 31. Device Number Example for Auto Parts
Figure 32. Device Number Example for IMM Parts
S
MC
9 S08
MC9S08LG32 Series Data Sheet, Rev. 7
Table 23. Package Descriptions
9 S08
LG 32
LG 32
Abbreviation
J0
LQFP
LQFP
LQFP
X
C
XX
XX
Temperature range
Maskset Identifier Suffix
(First digit usually references wafer fab
Second digit usually differentiates mask rev)
Approximate Flash size in KB
Package designator (see
(C = –40 °C to 85 °C)
(V = –40 °C to 105 °C)
Designator
Temperature range
Package designator (see
Approximate Flash size in KB
(C = –40 °C to 85 °C)
LH
LK
LF
Table
Case No.
917A
840F
932
Table
23. For the latest
Table
23)
Package Information
23)
Document No.
98ASS23237W
98ASS23234W
98ASH00962A
39