PR33MF51NSZF Sharp Microelectronics, PR33MF51NSZF Datasheet - Page 11

• Manufacturer Part Number: PR33MF51NSZF
• Description: RELAY SSR TRIAC OUT 300MA 8-DIP
• Manufacturer: Sharp Microelectronics
• Series: PR33MFr

Specifications of PR33MF51NSZF

• Circuit: SPST-NO (1 Form A)
• Output Type: AC
• Load Current: 300mA
• Voltage - Input: 1.2VDC
• Voltage - Load: 0 ~ 240 V
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
• Load Voltage Rating: 600 V
• Load Current Rating: 0.3 A
• Output Device: Triac
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• On-state Resistance: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 425-2647-5

● Cleaning instructions
● Presence of ODC
Solvent cleaning :
Ultrasonic cleaning :
Recommended solvent materials :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fi ne in ac-
tual using conditions since some materials may erode the packaging resin.
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead
diphenyl ethers (PBDE).
(
*
)
(
*
High melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
is exempted from the requirements.
)
, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
11
PR33MF51NSZF Series
Sheet No.: D4-A03901EN