08053C104KAT2A AVX Corporation, 08053C104KAT2A Datasheet - Page 16

• Manufacturer Part Number: 08053C104KAT2A
• Description: CAP CERM .10UF 10% 25V X7R 0805
• Manufacturer: AVX Corporation

Specifications of 08053C104KAT2A

• Capacitance: 0.1µF
• Tolerance: ±10%
• Package / Case: 0805 (2012 Metric)
• Voltage - Rated: 25V
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.94mm Max
• Voltage Rating: 25 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: General Type MLCCs
• Dimensions: 1.25 mm W x 2.01 mm L
• Termination Style: SMD/SMT
• Dielectric Characteristic: X7R
• Capacitance Tolerance: ± 10%
• Capacitor Case Style: 0805
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Brand/series: AVX
• Case Size: 0805
• Dielectric Strength: No breakdown or visual defects
• Dissipation Factor: 3 %
• Dissipation Factor, Test Condition: (Max.)
• Insulation Resistance: 100000 Megohms
• Length: 0.079 in. ± 0.008 in.
• Material, Element: Ceramic
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Voltage, Rating: 25 VDC
• Width: 0.049 in. ± 0.008 in.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 478-3755-2

Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Recommended Soldering Profiles
Lead-Free Reflow Profile
Termination Type
Nickel Barrier
300
250
200
150
100
50
0
0
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Reflow
300
250
200
150
100
50
0
(Minimize soldering time)
50
1min
Tin/Lead/Silver Temp. °C
Preheat
60/40/0
Solder
100
1min
150
10 sec. max
260 ± 5
Solder
220°C
250°C
to
200
Natural
Cooling
Immersion Time
Time (s)
Seconds
250
30 ± 1
300
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other para-
meters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
b) Resin color may darken slightly due to the increase in
c) Lead-free solder pastes do not allow the same self align-
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
temperature required for the new pastes.
Wave
300
250
200
150
100
50
0
(Preheat chips before soldering)
T/maximum 150°C
1 to 2 min
Preheat
T
3 sec. max
230°C
250°C
to
Natural
Cooling
71